BGA IC Package Substrate With Cap Plated MGC BT material
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Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface
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BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface BGA IC Packaging Solution ESD Stable Surface Resistance Matrix Tray JEDEC Tray/Matrix Tray/IC Tray/ESD Packing Tray Antistatic trays are among those things that should top your must-have list......
Shenzhen Hiner Technology Co., Ltd.
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H9HCNNN8KUML-HRNME Low Power 8Gb LPDDR4 Synchronous DRAM Memory IC Chip in BGA-200 Package
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...BGA-200 package. Specifications Of H9HCNNN8KUML-HRNME Memory Size:8Gb Memory Organization:256M x 32 Package:BGA-200 Voltage - Supply:1.1V(VDD2,VDDCA,VDDQ) Control signal supply voltage: 1.8V (VDD1) Clock frequency:2.......
ShenZhen Mingjiada Electronics Co.,Ltd.
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88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 MARVELL LQFP80 BGA IC Integrated Circuits Components
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...ICs) 88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 MARVELL LQFP80 BGA IC Integrated Circuits Components Specification :88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 Category Integrated Circuits (ICs) Product Name Electronic components Model number 88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 Mfr FAIRCHILD Series IC Components Package Standard package Condition New and original Package......
Angel Technology Electronics Co
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Automotive Electronics Package Substrate Featuring Copper Thickness 0.5oz 3oz Suitable for Electronic Device Production
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...package substrate or IC substrate PCB, this product serves as a foundational component in the assembly of integrated circuits (ICs), providing both mechanical support and electrical connectivity. With its ability to accommodate from 1 up to 32 layers, the...
Hing Technology Co. Ltd
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88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 MARVELL LQFP80 BGA IC Integrated Circuits Components
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...ICs) 88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 MARVELL LQFP80 BGA IC Integrated Circuits Components Specification :88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 Category Integrated Circuits (ICs) Product Name Electronic components Model number 88SM4140C1-LAD1C000 88W8787-A1-BKB2E000 Mfr FAIRCHILD Series IC Components Package Standard package Condition New and original Package......
HK NeoChip Technology Limited
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IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning
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IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning The Unicomp AX8300 is a professional, purpose-built X-ray ......
Unicomp Technology
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XC6SLX9 Programmable Logic ICS Bga Ic Chips SMT SMD FBGA
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...BGA original XC6SLX9-2FTG256C XC6SLX9-2FT256C BGA256 IC Datasheet Product Spartan-6 Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ALM Embedded Memory 576 kbit Number of I/Os 186 I/O Operating Supply Voltage 1.2 V Minimum Operating Temperature 0 C Maximum Operating Temperature + 85 C Mounting Style SMD/SMT Package......
ChongMing Group (HK) Int'l Co., Ltd
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XC6SLX9 Programmable Logic ICS Bga Ic Chips SMT SMD FBGA
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...BGA original XC6SLX9-2FTG256C XC6SLX9-2FT256C BGA256 IC Datasheet Product Spartan-6 Series XC6SLX9 Number of Logic Elements 9152 LE Adaptive Logic Modules - ALMs 1430 ALM Embedded Memory 576 kbit Number of I/Os 186 I/O Operating Supply Voltage 1.2 V Minimum Operating Temperature 0 C Maximum Operating Temperature + 85 C Mounting Style SMD/SMT Package......
LU'S TECHNOLOGY CO., Ltd.
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