Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
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... a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic ......
Unicomp Technology
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BT material BGA semiconductor package Substrate production
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... Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which...
HongRuiXing (Hubei) Electronics Co.,Ltd.
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XC7K160T-L2FBG676E Programmable IC Chip 676-FCBGA Package Embedded FPGAs Automotive Grade Industrial Device 0.93V
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...FCBGA Package Embedded FPGAs Automotive Grade Industrial Device 0.93V Number of LABs/CLBs 12675 Number of Logic Elements/Cells 162240 Total RAM Bits 11980800 Number of I/O 400 Voltage - Supply 0.87V ~ 0.93V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA......
Shenzhen Sai Collie Technology Co., Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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Customized Image Sensor Packaging Services For PLCC BGA Ceramic Packages
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...adaptability, and compatibility with end devices. For image sensors of various sizes provided by customers across different industries, we offer customized packaging services for PLCC, BGA, and ceramic housings. Using sensor size parameters as the core, we...
Chongqing Zhongshun Microelectronics Co., Ltd
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High Reliability Automotive Grade EMMC5.1 with 5 Years Warranty Storage Component 64GB 128GB 256GB BGA 153 Package
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High Reliability Automotive Grade EMMC5.1 with 5 Years Warranty Storage Component 64GB 128GB 256GB BGA 153 Package Available in 64GB, 128GB, and 256GB capacities with BGA 153 package, this automotive-grade eMMC 5.1 storage component delivers exceptional ......
China Chips Star Semiconductor Co., Ltd.
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BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface
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BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface BGA IC Packaging Solution ESD Stable Surface Resistance Matrix Tray JEDEC Tray/Matrix Tray/IC Tray/ESD Packing ......
Shenzhen Hiner Technology Co., Ltd.
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STM32F439NIH6 Embedded Microcontroller MCU 2MB Flash BGA-216 Package
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...BGA-216 Package Product Description Of STM32F439NIH6 STM32F439NIH6 is a 32-bit RISC processor that features exceptional code-efficiency, delivering the high-performance expected from an Arm core in the memory size usually associated with 8- and 16-bit devices. Specification Of STM32F439NIH6 Part Number: STM32F439NIH6 Package: BGA......
ShenZhen Mingjiada Electronics Co.,Ltd.
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FCBGA Packaging Jet Underfill Dispenser CUF Inline Cnc Glue Dispenser ISO
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The GS600 Series Inline Jet Underfill Dispenser is Mingseal’s next-generation solution engineered specifically for FCBGA encapsulating applications, where process stability, ultra-fine dispensing paths, and precise glue control are critical to yield and ......
Changzhou Mingseal Robot Technology Co., Ltd.
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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