TIF100 6520-11 High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad
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... 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad Product descriptions TIF®100 6520-11 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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1.5W/M. K Silicone Thermal Pad Manufacturer Direct Sale High Temperature Thermal Pad For CPU/GPU/SSD
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... to protect precision components that are extremely sensitive to mechanical stress. This product combines good thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. Features > Good thermal conductivity: 1.5W/mK >...
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Silicone Rubber Heatsink Thermal Pad For Audio And Video Components
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Silicone Rubber Heatsink Thermal Pad For Audio And Video Components Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, ......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Electronics CPU Silicone Thermal Pad Industry Thermal Interface Pad
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Product Description: Electrically Insulating Silicone Thermal Pad For Medical Equipment Field The Silicone Thermal Pad is a high quality and durable thermal interface material, specially designed for electronic components such as CPUs, GPUs, and other heat......
Shenzhen Antac Technology Limited
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3W/MK Soft Silicone Thermal Pad Insulating Sheet for Computer CPU GPU Chip Heat Sink Heatsink Cooling Thermal Conductive Pad
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Product Description: Our Thermal Conductive Silicone Pad is made of silicone, a durable material that can withstand high temperatures and harsh environmental conditions. With a hardness of 45 ShoreC and a tensile strength of 3 MPa, this Thermal Heat Sink ......
Shenzhen Linmao Electronic Material Co.,Ltd.
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1.4W/M.K LED Thermal Interface Pad , Conductive Thermal Gap Filler Pad Reusable
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... interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal conductivity 1.0 W/M.K~6.0W/M.K 2. Thickness 0.2-20mm 3. Customized 4. Easy to install APPLICATION * Communication equipment * LED lighting *...
SZ PUFENG PACKING MATERIAL LIMITED
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