2.8G/CC Heat Sink Thermal Grease High Temp For GPU
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... Density(g/cc) 2.8 ASTM D792 Usage Temperature(℃) -40~150 -- Thermal Thermal conductivity(W/m.K) 1.0 ASTM D5470 Thermal Resistance(℃-in2/W)0.1mm@50psi) 0.15 ASTM D5470 Product feature ■ Thermal conductivity: 1.0~5.0 W/m.K ■ No cure required ■...
Shenzhen Aochuan Technology Co., Ltd
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Stability Silicone Thermal Gap Filler Thermal Gel Thermal Putty For Heat-Sink And Frame
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Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module Products Description TIF®050-11 is a soft silicone gel-based gap filler pad, formulated with aspecial blend of fillers to provide both excellent thermal ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Specific Gravity 3.25 G/Cc Silicone Pads For High Speed Mass Storage Drives
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Specific Gravity 3.25 g/cc High Durability Silicone Pads for High Speed Mass Storage Drives Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, ......
Dongguan Ziitek Electronical Material and Technology Ltd.
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