Micro CMOS Sensor FPC Camera Module 12MP Sony IMX363 4032*3204 Resolution
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... IMX363-AAQH5-C is a diagonal 7.05mm (Type 1/2.55) 12 Mega-pixel CMOS active pixel type stacked image sensor with square pixel array. It adopts Exmor RS™ technology to...
Guangzhou Sincere Information Technology Ltd.
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5MP DVP Flexible FPC Camera Module Edge Enhancement Auto Flicker Correction
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...h S5K4ECGX sensor from Sumsang.The S5K4ECGX is a highly integrated 5Mp camera chip which includes a CMOS image sensor and an image signal processor with 8-bit ITU-R.656/601 parallel and MIPI CSI2 compliant serial interfaces. It is fabricated by SAMSUNG 0...
Shenzhen Sinoseen Technology Co., Ltd
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OV5640 5MP CMOS Sensor MIPI Camera Module 2K 1080P Auto Focus
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...Camera Module 5 Megapixel Auto Focus Lens MIPI DVP Interface for ESP32 Development Boards OV5640 FPC Product Description 5MP OV5640 DVP Camera Module The OV5640 ESP32 Camera Module is a high-performance 5MP (2592×1944 resolution) camera module with a 24Pin MIPI DVP interface designed for embedded vision applications. The module is equipped with OmniVision's OV5640 image sensor......
Shenzhen City Haozhou Technology Co., Ltd.
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OS02N10 MIPI Camera Module 2.5umX 2.5um Fpc Camera Module 1920 X 1080
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Customized New Product MIPI Camera Module 2 Million OS02N10 1920*1080 30fps Fixed Focus No Distortion OS02N10 1080P MIPI CSI-2 Camera Module: TYS-2MN10-V6 MIPI CSI-2 camera module with OS02N10 image sensor resolution of up to 1920 × 1080 and 30 frames per ......
Tuyuan Shun Intelligence (shenzhen) Co., Ltd.
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4 Layer ENIG Surface Finishing Electronic Board Custom PCB for Connector Camera Module
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8-Layer Double-Sided Gold-Plated PCB for Compact Electronics: This 8-panel double-sided printed circuit board (PCB) features gold-plated pads, fine-pitch FPC connectors, and precision routing for compact electronic modules. Ideal for IoT, sensor, or ......
Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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TESA 61370 Transparent PET Double Sided Tape battery for high-temperature applications
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... : Electronic die-cutting: Mobile accessory materials (such as camera pads, FPC reinforcements), touch screen frame bonding, OLED module fixation High-precision assembly: Lens brackets, sensor positioning, film switch back adhesive Industrial bonding: Sign...
SZ PUFENG PACKING MATERIAL LIMITED
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