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Electroplating Raw Copper Lead Frame with Electroplating Surface

Categories Others
Model NO.: leadframe
Material: Raw Copper material
Mould: Stamping tooling
Surface Processing: Electroplating
Process: Forming Process
Industry: Electronics
Customized: Customized
Transport Package: Pallte
Origin: China
Place of Origin: China
Certification: ISO9001:2015, ISO14001:2015, IATF16949
MOQ: 3,000 Pieces
Price: Negotiable
Delivery Time: Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Payment Terms: LC, T/T, PayPal
Supply Ability: 10000000000piece/Year
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  • Product Details
  • Company Profile

Electroplating Raw Copper Lead Frame with Electroplating Surface

JINAN JINGHENG ELECTRONICS CO., LTD(Leadframe Factory). The company has strong technical force, sophisticated process equipment, and complete testing devices. It has advanced High-speed Presses and Automatic Roll to Roll Electroplating Line introduced from Japan, with an annual production capacity of 2 billion Semiconductor Integrated Circuit Lead frames and 2 billion Semiconductor Discrete Device Lead frames.
At present, the company's major products are LED series, TO series, SMA series, ABS Bridge and SOP series, DIP series, etc. Since 2015, the company has further expanded its business scope, and added Tin-plating processing of electronic components.




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