RO3210 30mil 2 Layer Immersion Silver Rogers Pcb Circuits

The Rogers RO3210 High Frequency PCB is engineered for superior electrical performance and mechanical stability, making it the go-to solution for complex, high-frequency applications. Utilizing ceramic-filled laminates reinforced with woven fiberglass, this PCB combines the benefits of rigidity and surface smoothness, ensuring reliability in demanding environments.

Key Features
Dielectric Constant (Dk): 10.2 ± 0.5
Dissipation Factor: 0.0027 at 10 GHz
Coefficient of Thermal Expansion: Matched to copper (x: 13 ppm/°C, y: 13 ppm/°C, z: 34 ppm/°C)
Decomposition Temperature (Td): 500 °C (TGA)
Thermal Conductivity: 0.81 W/mk
Flammability Rating: V0 per UL 94 standard

Benefits
Enhanced Rigidity: Woven glass reinforcement facilitates easier handling and assembly.

Uniform Performance: Provides consistent electrical and mechanical properties across complex designs.

Low In-Plane Expansion: The matched expansion coefficient ensures compatibility with epoxy multi-layer boards and reliable surface-mounted assemblies.

Excellent Dimensional Stability: Guarantees high production yields and minimizes defects.

Surface Smoothness: Enables finer line etching tolerances for intricate designs.

This PCB features a 2-layer rigid stackup, with a copper layer thickness of 35 μm on both sides and a 0.762 mm (30 mil) Rogers RO3210 core. The board dimensions measure 120 mm x 80 mm (± 0.15 mm), with a finished board thickness of 0.8 mm. The minimum trace and space are set at 5/5 mils, with a minimum hole size of 0.3 mm. The finished copper weight is 1 oz (1.4 mils) on the outer layers, and the via plating thickness is 20 μm. This PCB is finished with immersion silver, providing excellent solderability.

The artwork for this PCB is provided in Gerber RS-274-X format, ensuring compatibility with industry standards. Each PCB adheres to IPC-Class-2 quality standards and undergoes 100% electrical testing prior to shipment, guaranteeing reliability and performance.

Applications
The Rogers RO3210 PCB is versatile and suitable for a wide range of applications, including:

Automotive collision avoidance systems
Global positioning satellite antennas
Wireless telecommunications systems
Microstrip patch antennas
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communications, high-frequency passive components, microstrip and stripline circuits, millimeter-wave equipment, radar systems, and digital RF antennas. Bicheng's high-frequency PCBs are primarily manufactured using three major high-frequency material brands—Rogers Corporation, Taconic, and Wangling—with dielectric constants ranging from 2.2 to 10.2. Headquartered in the economically vibrant city of Shenzhen, Bicheng PCB operates with a philosophy centered on serving small and medium-sized enterprises, offering a wide variety of circuit boards to meet diverse market demands.

Main Business & PCB Applications

The company upholds the highest manufacturing standards to deliver products known for exceptional quality, performance, and reliability. In addition to high-frequency PCBs, Bicheng has divisions specializing in FR-4 circuit boards, high frequency PCBs, and RF PCBs, supporting everything from prototyping and small-batch production to mass manufacturing. The company actively develops value-added PCB solutions, including HDI, quick-turn production, impedance control, heavy copper, and backplane boards. This strategic focus enables Bicheng to offer an extended and complementary product range, forming an integrated line that spans from low-end to high-end PCBs. These circuit boards are widely used in home appliances, portable and consumer electronics, medical devices, aerospace, and telecommunications.

Main Material Partners