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Rogers PCB 30mil RO3203 2 Layer Immersion Silver RF Circuits

Categories RF PCB Board
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Material: Rogers RO3203 Substrate
PCB size: 30mm x 60 mm=1PCS
Copper weight: 1oz (1.4 mils) outer layers
Surface finish: Immersion silver
Layer count: 2-layer
PCB Thickness: 0.8 mm
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Rogers PCB 30mil RO3203 2 Layer Immersion Silver RF Circuits

The RO3203 PCB is engineered from high-frequency circuit materials that combine ceramic-filled laminates with woven fiberglass reinforcement. Part of the renowned RO3000 Series, this laminate is designed for exceptional electrical performance and enhanced mechanical stability, making it suitable for demanding applications beyond 40 GHz. With a dielectric constant of 3.02 and a dissipation factor of 0.0016, the RO3203 PCB provides reliable solutions for high-frequency circuit designs.


Features
Material Type: Ceramic-filled PTFE composites
Dielectric Constant: 3.02 ±0.04 at 10 GHz/23°C
Dissipation Factor: 0.0016 at 10 GHz/23°C
Thermal Degradation Temperature (Td): > 500°C
Thermal Conductivity: 0.87 W/mK
Coefficient of Thermal Expansion (CTE):
X-axis: 13 ppm/°C
Y-axis: 13 ppm/°C
Z-axis: 58 ppm/°C

Flammability Rating: 94V-0, lead-free process compatible


Benefits
Improved Rigidity: Woven glass reinforcement allows for easier handling.
Consistent Performance: Ideal for complex multi-layer high-frequency structures.
Low Dielectric Loss: Suitable for applications exceeding 20 GHz.
Expansion Coefficient Matching: Low in-plane expansion coefficient for reliable surface-mounted assemblies.
High Dimensional Stability: Ensures excellent production yields.
Cost-Effective: Economically priced for volume manufacturing.
Surface Smoothness: Facilitates finer line etching tolerances.


PropertyRO3203DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.02±0.04Z10 GHz/23℃IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ0.0016Z10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Conductivity0.47 (3.2)W/mKFloat 100℃ASTM C518
Volume Resistivity107MΩ.cmAASTM D257
Surface Resistivity107MΩAASTM D257
Dimensional Stability0.08X, Ymm/m +E2/150after etchIPC-TM-650 2.4.3.9
Tensile ModulusX YkpsiRTASTM D638
Flexural Modulus400 300X YkpsiAASTM D790
Tensile Strength12.5 13X YkpsiRTASTM D638
Flexural Strength9 8X YkpsiAASTM D790
Moisure Absorption<0.1%D24/23IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion58 13Z X,Yppm/℃-50 ℃to 288℃ASTM D3386
Td500℃TGAASTM D3850
Density2.1gm/cm323℃ASTM D792
Copper Peel Stength10 (1.74)lbs/in (N/mm)After solderIPC-TM-650 2.4.8
FlammabilityV-0UL 94
Lead-Free Process CompatibleYes

Technical Specifications

Stackup Configuration: 2-layer rigid PCB

Copper Layer 1: 35 μm
RO3203 Substrate: 30 mil (0.762 mm)
Copper Layer 2: 35 μm


Finished Board Thickness: 0.8 mm
Finished Copper Weight: 1 oz (1.4 mils) on outer layers
Minimum Trace/Space: 4/7 mils
Minimum Hole Size: 0.55 mm
Vias: 27 (no blind vias)
Surface Finish: Immersion Silver
Silkscreen: None on top or bottom
Solder Mask: None on top or bottom
Electrical Testing: 100% electrical test conducted prior to shipment



Quality Standards
This PCB meets IPC-Class-2 standards, ensuring high reliability for various applications.


Typical Applications
Automotive collision avoidance systems
Global positioning satellite antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure


Availability
The RO3203 PCB is available worldwide, making it an excellent choice for engineers and designers in need of high-performance RF and microwave solutions.


PCB Material:Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation:RO3203
Dielectric constant:3.02±0.04
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..
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