high aspect ratio TGV Foundary Capabilities for semiconductor packaging

Description:

As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:10 to 1:160. The line width/space can be varied from 10um to 15um. The most important factor here is the adhesion between glass and copper is controlled from 10N/cm to 15N/cm. The roughness of glass can be controlled well in order to keep high adhesion.

Applications:

1,In the field of semiconductor packaging, glass substrate can meet the needs of larger size packaging due to its significant electrical and mechanical performance advantages, and become an important direction for the development of advanced packaging in the future.

2,In the field of display technology, glass substrates are widely used in the manufacture of liquid crystal displays and other flat panel display devices, such as tablet PCs, cell phones, and TVs.

Competitive Advantage:

• Very high aspect ratio (diameter/thickness of the glass): 1:10-1:160
• Very high adhesion strength between copper and glass
• Several glass types can be used in the production line, process window is wider.
• Shape of glass, uniformity and angle can be steadily controlled.

Guangdong Fozhixin (FZX）microelectronic technology research Pte Ltd was registered in Foshan city, Guangdong province of PRC, 2018. FZX was focus on panel level packaging technology development and mass production. At present, FZX has a factory which was about more than 2000 meter square. In addition, there is another mass production site being built up with more than 5000 meter square in Foshan city as well. MOS chip package, GaN package and LED/driver one package, etc. are major products that are shipped to the final customers. FZX also delivered the glass core substrate to the customers and owned the mass production capability with more than 3000 glass panels (size with 510mmX 515mm) output per month. FZX has own more than 180 IPs that were ranked No.4 world wide in fan-out field. FZX is a leading OSAT on panel level packaging (PLP) and provides engineering and mass production service for more than 100 customers of global market. Trust and delight customers are always company core culture and value. It is always a great honour to serve you and make you better.