Sign In | Join Free | My infospaceinc.com
infospaceinc.com
Products
Search by Category
Home > Active Components >

RT Duroid 6006 PCB 10mil 0.254mm 2-Layer Immesion Gold

Categories RF PCB Board
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Material: RT duroid 6006
Layer count: 2-layer
PCB size: 161.42mm x 63.57 mm=4 Types=4PCS, +/- 0.15mm
PCB thickness: 10 mil
Copper weight: 1oz (1.4 mils) outer layers
Surface finish: Immersion Gold
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

RT Duroid 6006 PCB 10mil 0.254mm 2-Layer Immesion Gold

Introducing a newly shipped PCB based on RT/Duroid 6006 substrate. It is designed for high-performance electronic and microwave applications. Utilizing Rogers RT/Duroid 6006 laminates, this PCB offers exceptional dielectric properties, making it ideal for compact circuit designs without compromising on performance. Its robust construction and reliable features are tailored for applications operating at X-band or below.


Key Features

- Material Composition: Made from Rogers RT/Duroid 6006 ceramic-PTFE composites.
- Dielectric Constant (Dk): 6.15 ± 0.15 at 10 GHz/23°C for superior circuit performance.
- Dissipation Factor: Low loss with a dissipation factor of 0.0027 at 10 GHz/23°C, ensuring efficiency.
- Thermal Stability: Thermal degradation temperature exceeding 500 °C (TGA).
- Moisture Resistance: Extremely low moisture absorption at 0.05%, enhancing reliability.
- Coefficient of Thermal Expansion (CTE): X-axis: 47 ppm/°C, Y-axis: 34 ppm/°C, Z-axis: 117 ppm/°C for dimensional stability.
- Copper Foil: Clad with standard and reverse treated electrodeposited copper foil.


PropertyRT/duroid 6006DirectionUnitsConditionTest Method
Dielectric Constant,εProcess6.15±0.15Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign6.45Z8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0027Z10 GHz/AIPC-TM-650 2.5.5.5
Thermal Coefficient of ε-410Zppm/℃-50℃-170℃IPC-TM-650 2.5.5.5
Volume Resistivity7 x 107Mohm.cmAIPC 2.5.17.1
Surface Resistivity2 x 107MohmAIPC 2.5.17.1
Tensile PropertiesASTM D638 (0.1/min. strain rate)
Young's Modulus627(91) 517(75)X YMPa(kpsi)A
Ultimate Stress20(2.8) 17(2.5)X YMPa(kpsi)A
Ultimate Strain12 to 13 4 to 6X Y%A
Compressive PropertiesASTM D695 (0.05/min. strain rate)
Young's Modulus1069 (115)ZMPa(kpsi)A
Ultimate Stress54(7.9)ZMPa(kpsi)A
Ultimate Strain33Z%
Flexural Modulus2634 (382) 1951 (283)XMPa(kpsi)AASTM D790
Ultimate Stress38 (5.5)X YMPa(kpsi)A
Deformation under load0.33 2.1Z Z%24hr/50℃/7MPa 24hr/150℃/7MPaASTM D261
Moisture Absorption0.05%D48/50℃ 0.050"(1.27mm) thickIPC-TM-650 2.6.2.1
Thermal Conductivity0.49W/m/k80℃ASTM C518
Coefficient of Thermal Expansion47
34
117
X
Y
Z
ppm/℃23℃/50% RHIPC-TM-650 2.4.41
Td500℃ TGAASTM D3850
Density2.7g/cm3ASTM D792
Specific Heat0.97(0.231)j/g/k
(BTU/ib/OF)
Calculated
Copper Peel14.3 (2.5)pli (N/mm)after solder floatIPC-TM-650 2.4.8
FlammabilityV-0UL 94
Lead-free Process CompatibleYes

Benefits

- Circuit Size Reduction: High dielectric constant enables smaller circuit designs.
- Low Loss Performance: Optimized for X-band applications, minimizing signal loss.
- Repeatable Performance: Tight control of εr and thickness ensures consistency across productions.
- Reliability: Features reliable plated through-holes for multi-layer board designs.


PCB Specifications

Stackup: 2-layer rigid PCB


Copper Layer 1: 35 μm

RT/Duroid 6006: 0.254 mm (10 mil)

Copper Layer 2: 35 μm


The board dimensions measure 161.42 mm x 63.57 mm (± 0.15 mm), with a minimum trace/space of 4/6 mils and a minimum hole size of 0.4 mm. The finished board thickness is 0.4 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers, ensuring durability and robustness in performance.



Quality Assurance

Each RT/Duroid 6006 PCB undergoes rigorous 100% electrical testing prior to shipment, ensuring that every unit meets the highest quality standards. This commitment to quality gives customers peace of mind, knowing that they are receiving a product that has been thoroughly vetted for performance.


Applications
The RT/Duroid 6006 PCB is versatile and can be used in various applications, including:


Patch Antennas: Ideal for compact antenna designs that require high performance.


Satellite Communication Systems: Perfect for the demanding environment of satellite technology.


Power Amplifiers: Supports high-frequency applications without significant signal loss.


Aircraft Collision Avoidance Systems: Provides the reliability needed in critical aerospace applications.


Ground Radar Warning Systems: Essential for systems that require high reliability and performance.


PCB Material:Ceramic-PTFE Composites
Designation:RT/duroid 6006
Dielectric constant:6.15
Dissipation Factor0.0027 10GHz
Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..
Buy RT Duroid 6006 PCB 10mil 0.254mm 2-Layer Immesion Gold at wholesale prices
Send your message to this supplier
 
*From:
*To: Bicheng Electronics Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0