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| Categories | Ceramic capacitive pressure sensor chip |
|---|---|
| Brand Name: | Jingnawei |
| Place of Origin: | Henan |
| MOQ: | 1 |
| Price: | 1-30USD |
| Payment Terms: | L/C,T/T,Western Union |
| Supply Ability: | Half a million pieces per month |
| Delivery Time: | 5-10 work days |
| Packaging Details: | box |
Applications: high-power semiconductor module; Semiconductor cooler, electronic heater; Power control circuit, power mixing circuit. Intelligent power module; High frequency switching power supply, solid state relay. Automotive electronics, aerospace and military electronics components. Solar panel components; Telecommunications private exchange, receiving system; Laser and other industrial electronics. Ceramic substrate features:.
1. High thermal conductivity to meet device heat dissipation requirements;
2. Good heat resistance, meet the power device high temperature (more than 200℃) application requirements;
3. Match the thermal expansion coefficient, match the thermal expansion coefficient of the chip material, reduce the thermal stress of the package;
4. Small dielectric constant, good high-frequency characteristics, reduce the device signal transmission time, improve the signal transmission rate;
5. High mechanical strength to meet the requirements of mechanical properties in the process of device packaging and application;
6. Good corrosion resistance, able to withstand strong acid, strong alkali, boiling water, organic solution and other erosion;
7. Compact structure to meet the requirements of electronic device airtight packaging
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