Sign In | Join Free | My infospaceinc.com
infospaceinc.com
Products
Search by Category
Home > Professional Audio, Video & Lighting >

High Thermal Conductivity Customizable Thickness Soft Thermal Pad For CPU GPU Cooling Specific Gravity 2.5g/cm³

Categories Silicone Thermal Pad
Brand Name: Ziitek
Model Number: TIF520-20-11U
Certification: UL & RoHS
Place of Origin: China
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: High Thermal Conductivity Customizable Thickness Soft Thermal Pad For CPU GPU Cooling Specific Gravity 2.5g/cm³
Thermal Conductivity: 2.0 W/mK
Hardness: 27 Shore 00
Keywords: Thermal Pad
Thinkness range: 0.010"(0.25mm)~0.200" (5.0mm)
Color: Dark Gray
Flam rating: 94 V-0
Specific Gravity: 2.5g/cm³
Application: CPU GPU Cooling
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

High Thermal Conductivity Customizable Thickness Soft Thermal Pad For CPU GPU Cooling Specific Gravity 2.5g/cm³

High Thermal Conductivity Customizable Thickness Soft Thermal Pad For CPU GPU Cooling Specific Gravity 2.5g/cm³


Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


The TIF®520-20-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.


Features:


> Excellent thermal conductivity 2.0W/mK

> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant


Applications:


> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> CD-Rom, DVD-Rom cooling
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules


Typical Properties of TIF®500-20-11U Series
PropertyValueTest method
ColorDark GrayVisual
Construction & CompostionCeramic filled silicone elastomer******
Density(g/cm³)2.5ASTM D792
Thickness Range(inch/mm)0.010~0.0200.030~0.200ASTM D374
(0.25~0.50)(0.75~5.0)
Hardness65 Shore 0027 Shore 00ASTM 2240
Recommended Operating Temperature-40 to 200℃******
Breakdown Voltage(V/mm)≥5500ASTM D149
Dielectric Constant4.5 MHzASTM D150
Volume Resistivity>1.0X1012 Ohm-meterASTM D257
Flame ratingV-0UL94 (E331100)
Thermal conductivity2.0 W/m-KASTM D5470
2.0 W/m-KISO22007

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mm×406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.


FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.


Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.


Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Buy High Thermal Conductivity Customizable Thickness Soft Thermal Pad For CPU GPU Cooling Specific Gravity 2.5g/cm³ at wholesale prices
Send your message to this supplier
 
*From:
*To: Dongguan Ziitek Electronical Material and Technology Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0