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Rogers RO4533 PCB 0.8mm 2-Layer ENEPIG Finish

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Rogers RO4533
Layer count: 2-layer
PCB thickness: 0.8mm
PCB size: 46.95mm × 53.13mm
Silkscreen: white
Solder mask: Green
Copper weight: 1oz (1.4 mils) for outer layers
Surface finish: Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
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Rogers RO4533 PCB 0.8mm 2-Layer ENEPIG Finish

This 2-layer rigid PCB adopts Rogers RO4533, a ceramic-filled, glass-reinforced hydrocarbon-based material. It is specifically engineered to reliably meet the stringent requirements for high-frequency signal transmission in precision RF application scenarios, particularly suitable for mobile infrastructure microstrip antenna applications.


PCB Specifications

ParameterDetails
Layer Count2-Layer (rigid structure)
Base MaterialRogers RO4533
Board Dimensions46.95mm × 53.13mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space4 mils (trace) / 5 mils (space)
Minimum Hole Size0.4mm
ViasNo blind vias; Total vias: 19; Via plating thickness: 20 μm
Finished Board Thickness0.8mm
Finished Copper Weight1oz (1.4 mils) for outer layers
Surface FinishElectroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
SilkscreenWhite silkscreen on top layer; No silkscreen on bottom layer
Solder MaskGreen solder mask on top layer; No solder mask on bottom layer
Quality Assurance100% electrical test conducted prior to shipment

PCB Stack-up

Layer NameMaterialThickness
Top Copper Layer (Copper_layer_1)Copper35 μm
Substrate CoreRogers RO4533 Core0.762mm (30 mil)
Bottom Copper Layer (Copper_layer_2)Copper35 μm

Rogers RO4533 Material Introduction

Rogers RO4533 laminates are ceramic-filled, glass-reinforced hydrocarbon based material set, providing the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications. RO4533 laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing.


These laminates do not require special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing designers to optimize the price and performance of their antennas. Moreover, RO4533 laminates are available halogen-free to meet the most stringent “green” standards. The typical glass transition temperature of RO4533 materials exceeds 280°C (536°F), leading to a low z-axis CTE and excellent plated through-hole reliability.



Key Material Features

FeatureSpecification/Description
Material CompositionRogers RO4533 ceramic-filled, glass-reinforced hydrocarbon based material
Dielectric Constant (Dk)3.3 at 10 GHz
Dissipation Factor0.0025 at 10 GHz
Coefficient of Thermal Expansion (CTE)X axis: 13 ppm/°C; Y axis: 11 ppm/°C; Z axis: 37 ppm/°C
Glass Transition Temperature (Tg)>280 °C
Moisture Absorption0.02%
Thermal Conductivity0.6 W/mk
Surface Finish AdvantageENEPIG ensures excellent solderability, corrosion resistance and reliable bonding performance

Core Benefits

Superior RF Performance: Low loss, low Dk and excellent passive intermodulation (PIM) response, suitable for a wide range of RF applications.


Excellent Process Compatibility: Thermoset resin system compatible with standard PCB fabrication processes, no special treatment for plated through-hole preparation.


Excellent Dimensional Stability: Ensures higher yield on larger panel sizes, maintaining structural integrity during manufacturing and handling.


Uniform Mechanical Properties: Maintains mechanical form during handling, enhancing process reliability.


Enhanced Power Handling: High thermal conductivity improves heat dissipation efficiency, supporting better power handling capability.


Cost-Effective Solution: Affordable alternative to conventional PTFE antenna technologies, optimizing price-performance ratio.


Environmentally Friendly: Halogen-free option available, meeting stringent "green" standards.


Low Environmental Sensitivity: 0.02% moisture absorption minimizes performance degradation in humid environments.


Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification before shipment.


Availability: Globally available, enabling timely delivery and efficient after-sales support for international customers.


Typical Applications

-Cellular infrastructure base station antennas

-WiMAX antenna networks


Summary

By leveraging RO4533's superior electrical properties (low loss, low Dk, excellent PIM response), standard PCB process compatibility, this PCB serves as a trustworthy option for high-volume production of precision RF devices.


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