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130KV Electronics X Ray Inspection Machine For 300mm Sample Size

Categories 3D X Ray Inspection
Brand Name: WELLMAN
Model Number: T-130
Certification: CE FDA
Place of Origin: CHINA
MOQ: 1
Payment Terms: T/T
X-ray Tube Type: Closed-tube X-ray source
Tube voltage range: 40-130 KV
Pixel matrix: 1536×1536
Equipment size: 2150mmx900mmx1750mm(Length × width × height)
Pixel size: 100 μm
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130KV Electronics X Ray Inspection Machine For 300mm Sample Size

Compact and Space-Saving 3D X-Ray Inspection System
Ultra-table design for small-sized PCBA boards and semiconductor packaging products with high scanning accuracy and easy operation.
Key Equipment Features
  • Compact structure with minimal space requirements
  • One-click full-process automation for data scanning, 3D reconstruction, and image analysis
  • High precision scanning capabilities
Inspection Applications
  • Small-sized PCBA boards
  • Internal structure quality of semiconductor packaging products
  • SMT solder joint quality inspection including:
    • Cold solder joints
    • Wetting issues
    • Solder volume analysis
    • Component offset detection
    • Foreign object identification
    • Bridging detection
    • Pin presence verification
Technical Specifications
Ray Source Parameters
Type of ray tubeClosed tube X-ray source
Tube voltage range (T-130)40-130 KV
Detector Parameters
Detector typeAmorphous silicon flat panel detector
Pixel size (T-130)100μm
Pixel matrix (T-130)1536x1536
Equipment Performance Parameters
Maximum sample size (T-130)Diameter: 300mm * Height: 320mm
Maximum imaging area (T-130)Diameter: 200mm * Height: 120mm
JIMA card resolution3μm
Equipment weight (T-130)1T
Equipment dimensions (T-130)2150mm * 900mm * 1750mm (L*W*H)
Imaging Software System
  • Integrated scanning imaging software
  • 3D image reconstruction software
  • 3D image measurement and analysis software
  • Image database management software
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