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Copper Coin Embedded PCB 6-Layer M6+High TG FR4

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-052.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: M6 High Speed material + High Tg FR-4
Layer count: 6-layer
PCB thickness: 1.0mm
PCB size: 100mm × 50mm per unit (tolerance: ±0.15mm)
Copper weight: Outer Layers: 1oz (1.4 mils, ~35μm)- Inner Layers: Mixed 1oz (~35μm) & 0.5oz (~18μm
Surface finish: Electroless Nickel Immersion Gold (ENIG)
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Copper Coin Embedded PCB 6-Layer M6+High TG FR4

Copper coin embedded PCB 6-Layer M6+High TG FR4

This 6-layer PCB integrates high-performance M6 High Speed material with High Tg FR-4, designed for demanding high-frequency, high-temperature, and reliability-critical applications. It complies with global quality standards and supports complex circuit designs across industries like 5G, automotive, and aerospace.


1. PCB details

ParameterSpecification
Base MaterialM6 High Speed material + High Tg FR-4 (optimized for high-frequency performance)
Layer Count6 Layers (rigid structure)
Board Dimensions100mm × 50mm per unit (tolerance: ±0.15mm)
Trace/Space (Minimum)4 mils (trace) / 5 mils (space)
Hole Size (Minimum)0.3mm (no blind vias)
Finished Board Thickness1.0mm
Copper Weight- Outer Layers: 1oz (1.4 mils, ~35μm)- Inner Layers: Mixed 1oz (~35μm) & 0.5oz (~18μm)
Via Plating Thickness20μm
Surface FinishElectroless Nickel Immersion Gold (ENIG) – ensures excellent solderability, corrosion resistance, and long-term reliability
SilkscreenTop/Bottom Layers: White (high contrast for component identification)
Solder MaskTop/Bottom Layers: Green (protects copper traces, prevents solder bridging)
Special Features- Copper coin embedded in the PCB center (enhances thermal conductivity)- All vias: Resin-filled and capped (prevents solder wicking, improves surface flatness for SMT assembly)
Quality Testing100% Electrical Test (open/short circuit detection) prior to shipment

2. PCB Stack-up

Layer TypeMaterial SpecificationThickness
Top Copper LayerElectrolytic Copper35 μm
Core LayerM6 High Speed Material (R5775G)0.25 mm
Inner Copper Layer 1 (Inn1)Electrolytic Copper18 μm
Prepreg Layer1080 Style Prepreg (64% resin content), 2 sheets stacked0.14 mm
Inner Copper Layer 2 (Inn2)Electrolytic Copper35 μm
Core LayerHigh Tg FR-4 (IT-180)0.1 mm
Inner Copper Layer 3 (Inn3)Electrolytic Copper35 μm
Prepreg Layer1080 Style Prepreg (64% resin content), 2 sheets stacked0.14 mm
Inner Copper Layer 4 (Inn4)Electrolytic Copper18 μm
Core LayerHigh Tg FR-4 (IT-180)0.1 mm
Bottom Copper LayerElectrolytic Copper35 μm


3. Material Advantages: M6 High Speed Material


The M6 material is the cornerstone of this PCB’s high-performance capabilities, offering exceptional electrical, thermal, and mechanical properties:


Electrical Performance:

Dielectric Constant (DK): 3.4 at 1GHz/23°C, 3.34 at 13GHz (low and stable across high frequencies, minimizing signal loss).


Dissipation Factor (Df): 0.002 at 1GHz/23°C, 0.0037 at 13GHz (ultra-low signal attenuation, critical for 5G/mmWave applications).


Thermal Stability:

High Glass Transition Temperature (Tg): >185°C (DSC method), 210°C (DMA method) – resists deformation under high operating temperatures.


Thermal Decomposition Temperature (Td): 410°C (TGA method) – ensures durability in extreme heat environments.


Mechanical Reliability:

Coefficient of Thermal Expansion (CTE): X/Y axis = 16 ppm/°C, Z axis = 45 ppm/°C (low thermal expansion, reduces stress from temperature cycles).


Flammability: UL 94V-0 (self-extinguishing, meets safety standards for electronics).


Manufacturability & Sustainability:

Compatible with traditional FR-4 processing (no special equipment required, lowering production costs). RoHS and halogen-free compliant (aligns with global green manufacturing standards).


Design Flexibility: Supports 4–30 layer multilayer PCBs, adapting to complex circuit architectures.


4. Quality & Availability

Quality Standard: IPC-Class-2 (meets industry requirements for general electronics, with consistent performance and reliability).


Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication, compatible with all major manufacturing systems).


Availability: Worldwide (supports global projects for large-scale production).


5. Typical Applications

This PCB is optimized for high-frequency, high-reliability scenarios, including:


5G Communication Base Stations: Millimeter-wave antennas, radio-frequency (RF) front-ends of Active Antenna Units (AAU) (leveraging M6’s low DK/DF for minimal signal loss).


Automotive Electronics: 77GHz millimeter-wave radar, Advanced Driver-Assistance Systems (ADAS) (high Tg and Td ensure durability in automotive temperature extremes).


Networking & Communications: High-speed routers, switches, and optical transceivers (supports complex multilayer designs for data-intensive circuits).


Aerospace & Defense: Radar systems, avionics, and military communication devices (meets strict reliability and environmental standards).


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