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Customizable Board Thinkness PCB FR4 Multilayer Design HASL Treatment

Categories Multilayer PCB Board
Brand Name: xingqiang
Model Number: As Per Customer's Model
Certification: ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Place of Origin: China
MOQ: Sample,1 pc(5 square meters)
Price: Based on Gerber Files
Payment Terms: ,T/T,Western Union
Supply Ability: 100000㎡/Month
Delivery Time: NA
Product: Multilayer PCB
Material: FR4
Min. hole Size: 0.1mm
Pcba Standard: IPC-A-610 E Class II
Minimum Line Space: 3mil (0.075mm)
Surface Finishing: HASL/OSP/ENIG
Customization Files: Gerber or BOM List
Special Ink: Matte black,Matte Green
Color: Green,Red,Blue,White,Black,Yellow
Board Thinkness: 1.6/1.2/1.0/0.8mm or Customized
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Customizable Board Thinkness PCB FR4 Multilayer Design HASL Treatment

Customized FR4 Multilayer Layer PCB

This high-performance multilayer PCB is expertly engineered to deliver exceptional electromagnetic compatibility (EMC), significantly reduced signal crosstalk, and improved signal integrity. Its multi-layer structure with premium dielectric materials isolates sensitive signal paths, ensuring stable high-frequency transmission. Ideal for advanced electronics: high-efficiency power supplies, 5G communication modules, rugged industrial controls, and compact embedded systems, meeting stringent technical demands for reliability and precision.



Advantages of Multilayer PCB:

  • Increase circuit board density
  • Reduce size
  • Better signal integrity
  • Adapt to high-frequency applications
  • Better thermal management
  • Higher reliability


Basical Features:

  • Multi-layer design
  • Inner layer and outer layer
  • through hole
  • Copper layer
  • Dielectric layer (dielectric material)


Multilayer PCB Customized services:

Send us your:
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)

Tips:Normally,Gerber files includes: PCB type,thickness, ink color, surface treatment process, and if SMT processing is required, you can provide a component BOM and reference designation diagram, etc.

We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.



Manufacturing process:

  • Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
  • Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
  • Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
  • Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).


Factory showcase


PCB Quality Testing



Certificates and Honors





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