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| Categories | Adhesive Dispensing Machine |
|---|---|
| Brand Name: | Mingseal |
| Model Number: | FS700F |
| Certification: | ISO CE |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | $28000-$150000 / pcs |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union |
| Delivery Time: | 5-60 Days |
| Packaging Details: | Wooden Case |
| Structure: | Floor-Type |
| Dimensions (W × D × H): | 1360 × 1280 × 1550mm |
| Dispensing Range ( W × D): | 900 × 600mm |
| Power: | 3.5KW |
| Company Info. |
| Changzhou Mingseal Robot Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This large format adhesive dispensing machine is designed for SMT production lines handling large boards and display modules. The platform integrates a heavy‑duty gantry, multi‑nozzle dispense heads, integrated 2D/3D vision alignment, or quick disassembly options, AOI for inline verification, and MES interfaces. It supports synchronized/asynchronized valve dispense modes for high UPH.
Problem: Large panels commonly show inconsistent dispensing and placement
drift across board width, causing functional defects.
Cause: Insufficient motion stability, poor registration on large
surfaces, adhesive temperature/viscosity variation and low
single‑head throughput lead to variability.
Solution: A large format gantry with multi‑nozzle banks, vision‑guided
fly-alignment and temperature‑controlled dispensing stabilizes
deposit volume and position; validated recipes and AOI ensure
repeatable production.
Structure | Floor-mounted gantry (marble frame + mobile gantry ) |
Dimensions (W × D × H) | 1360 × 1280 × 1550 mm |
Dispensing range ( W × D) ( Single valve vertical dispensing) | 900 × 600 mm |
Max. speed | X/ Y:1300 mm/ s Z: 500 mm/ s |
Max. acceleration | X/ Y:1.3 g Z: 0.5 g |
Repeatability (3 sigma) | X/ Y: ± 0.015 mm Z: ± 0.005 mm |
Positioning accuracy (3 sigma) | X/ Y: ± 0.03 mm Z: ± 0.01 mm |
Track width adjustment method | Automatic width adjustment |
Track width adjustment range | 150 ~ 500 mm |
Conveyor belt load | 5kg |
Max. substrate thickness | 0.5 ~ 10 mm |
Max. height of devices on top of PCB | 25 mm |
Max. height of devices on bottom of PCB | 25 mm |
Conveyor track | Stainless steel chains |
Camera pixels (optional) | 130 W black & white (Optional) |
Light source | RGB colored light source (Optional) |
Input voltage | 220 VAC 50 ± Hz |
Power | 3.5 KW |
Q: What is the minimum deposit size achievable?
A: Typical minimum volume ≥0.01 μL depending on nozzle and adhesive
viscosity—confirm with sample validation.
Q: Can the system handle filled adhesives?
A: Yes—use piston/peristaltic pump options with heated feed lines
for filled or thixotropic adhesives; validate in pilot tests.
Q: Does the machine support MES recipe management?
A: Yes—supports recipe push/pull and batch logging via standard
industrial protocols (EtherNet/IP / OPC‑UA / RS‑485).
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