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Areospace Rapid Rate Temperature Change Testing Chamber JEDEC (JESD 22-A104F)

Categories Environmental Stress Screening Chamber
Brand Name: Jianqiao
Model Number: JQESS-100
Certification: CE
Place of Origin: China
MOQ: 1
Payment Terms: ,T/T
Supply Ability: 300
Delivery Time: 5~ weeks
Heating System: Stainless Steel Tubular Heater
Cooling System: Mechanical Refrigeration
Warranty: 1 Year
Refrigeration Compressor: hermetic compressor(Tecumseh)
Humidity Uniformity: ±2.0%RH
Fan: Centrifugal blower
Humidifier: Steam humidifier
Humidity Control Range: 20.0%RH~95.0%RH
Evaporator: Fin - and - Tube Heat Exchanger
Chamber Size: 1000mm x 1000mm x 1000mm
Humidity Control: 10% ~95%RH
Packaging Details: Wooden case
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Areospace Rapid Rate Temperature Change Testing Chamber JEDEC (JESD 22-A104F)

Rapid Temperature Change Rate Cycling Chamber Chamber for accelerated product testing and reliability assessment


Rapid change temperature testing is a type of thermal cycling tests developed to improve the failure repeatability of thermal shock tests.
With the ongoing rise in issues affecting the reliability of electronic devices and circuit boards, a better-suited evaluation testing method is needed to respond to issues such as higher device operation temperatures resulting from greater semiconductor integration, changes in device mounting methods such as BGA and CSP, and the use of lead-free solder.
Rapid change temperature testing specifies a test sample temperature variation rate of 15°C/minute or less, which is the biggest difference between this method and thermal shock testing. Since rapid change temperature testing achieves highly repeatable test results, it is used for compliance testing for standards such as JEDEC (JESD 22-A104F).

Difference in specimen temperature changes in thermal shock testing and rapid thermal cycling tests

  • Outstanding temperature distribution creates uniform stress.
    The temperature distribution performance is outstanding even during temperature variation, providing uniform and highly repeatable stress.
    The optimum air flow and air velocity distribution are calculated by the simulation, minimizing the differences in stress caused by differences in specimen placement positions in the test space.


  • New function controls test sample temperature variation rate.
    Features a high-speed controller for specimen temperature control. This specimen temperature control is achieved by a variety of new technologies—the refrigeration capacity has been increased, the air-conditioning technology minimizes the temperature difference between the specimen and air, and uniform air velocity distribution minimizes the test sample temperature distribution.


  • Complies with JEDEC standard (JESD22-A104F).
    The Rapid-rate Thermal Cycle Chamber, that enables semiconductor package evaluations and solder junction evaluations in compliance with the JESD22-A104F standard, enables test sample temperature control at a rate of 15℃/minute (between -40 and +125°C).
  • Supports temperature control of test samples and air.
    Uses two control methods, enabling thermal cycling tests with specimen temperature control of 15℃/minute, and air temperature control. Supports many different applications, ranging from standards compliance testing to screening.






15 °C/mimutes

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