2D Solder Paste Thickness Inspection Machine
Brief Introduction (Optimized for Buyers)
As Surface Mount Technology (SMT) advances, electronic components
become increasingly smaller, packaging density becomes denser, and
solder joints shrink correspondingly. Nearly 70% of PCB assembly
defects are caused by improper solder paste printing.
The SH-110-2D Solder Paste Thickness Inspection Machine is designed
to solve this problem. It effectively identifies potential
defective solder deposits before component placement, provides
accurate SPC control data (CPK, Cp), and significantly reduces
defect rates.
In today's competitive electronic manufacturing environment, lower
defect rates translate directly into higher profits. Strict process
control requires factories to demonstrate their capability in
managing solder paste printing during production. This machine
provides that proof.
Beyond Solder Paste: The SH-110-2D can also be used in other
production fields. Any geometric information of objects and
components within 10 mm height can be precisely and non-contact
measured.
Technological Parameters
| Parameter | Specification |
|---|
| Measurement Principle | Non-contact laser triangulation |
| Measurement Accuracy | ±0.001 mm (±1 µm) |
| Repeat Measurement Accuracy | ±0.002 mm (±2 µm) |
| Base Dimensions (L*W*H) | 320 mm * 500 mm * 360 mm |
| Platform Type | Fixed marble platform (vibration-dampening) |
| Image System | VGA high-definition camera |
| Optical Magnification | 25* – 110* (5-step adjustable) |
| Measurement Light Source | High-definition red laser |
| Illumination | Adjustable annular LED (PC-controlled brightness) |
| Image Resolution | 600 * 480 pixels |
| Software | SH-110 / SPC100 (compatible with all Windows OS) |
| Power Supply | 95–240 V AC, 50 Hz, 1000 mA |
| Weight | 30 kg |
Application Area
| Category | Measurable Features |
|---|
| Solder Paste | Thickness, Area, Volume, Gap, Angle, Length, Width, Arc |
| Irregular Geometric Sizes | Any non-standard shape within 10 mm height |
| PCB & Printing Ink | Circuit line width, Pad height, Dimensional measurement |
| Electronic Components | Horizontal coplanarity |
| Image Processing | Image capture, Video processing, Documentary management |
| SPC Statistical Analysis | CPK, Cp, and print output with full reporting |
Standard Configuration (Included in Package)
| Item | Quantity |
|---|
| SH-110-2D Main Unit | 1 |
| Software Package (CD/USB) | 1 |
| Video Capture Card | 1 |
| Transmission Line | 1 |
| Video Signal Line | 1 |
| Software Encryptor (Dongle) | 1 |
| Corrective Gauges (Calibration Tool) | 1 |
| Power Cable | 1 |
| Operating Manual | 1 |
Operating Principle (Technical Explanation for Engineers)
The non-contact thickness gauge emits a very fine laser beam at a
fixed incident angle onto the measurement target. Because the
target (solder paste) and its surrounding substrate (PCB surface)
differ in height, the reflected sensor receives multiple laser
differences.
Based on the observed data, the analysis program—using
trigonometric functions—rapidly calculates and outputs precise
information about the measurement target, including height, width,
area, and derived volume.
