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Vision Guided Piezoelectric Jet Dispenser Machine HP-D30 With Online Visual Programming

Categories Fluid Dispensing Systems
Model Number: HP-D30
Certification: CE,ISO9001
Ultra-High Speed: 1000mm/s maximum movement for maximum throughput
Payment Terms: T/T
Delivery Time: 30 working days
Packaging Details: Wooden case with vacuum package inside
Automatic Width Adjustment: 50-400mm track width with SMEMA integration
Brand Name: Haipai
MOQ: 1 unit
Exceptional Precision: ±0.01mm repeat accuracy with servo + grinding screw drive
Place of Origin: China
Visual Programming: Online programming from board images for simple, fast setup
Piezoelectric Jet Technology: H-Y01 valve with customizable nozzle for precision non-contact dispensing
CCD Visual Positioning: Automatic calibration and real-time error correction
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Vision Guided Piezoelectric Jet Dispenser Machine HP-D30 With Online Visual Programming

High-Speed Piezoelectric Jet Dispensing Machine

Description:
The HP-D30 revolutionizes dispensing setup with its integrated CCD visual positioning system and online visual programming, eliminating complex code and manual teaching. Simply capture an image of your board, then define dispensing locations by clicking on the image—the system automatically generates dispensing paths with ±0.01mm precision. The CCD vision system provides automatic calibration and real-time error correction, ensuring perfect registration regardless of board variations or conveyor positioning. Behind this intuitive interface lies serious capability: the H-Y01 piezoelectric jet valve delivers non-contact dispensing at speeds up to 1000mm/s, handling materials from underfill to solder paste with customizable nozzle impact pins. The 400×400mm work area accommodates a wide range of PCBs, while automatic width adjustment (50-400mm) and SMEMA interface enable seamless line integration. For manufacturers seeking to reduce setup time and eliminate programming errors, the HP-D30's vision-guided intelligence delivers unmatched ease of use.

Technical Specifications
ModelHP-D30
Machine DimensionsL990*W1350*H1600mm
Weight1000kg
Control MethodIndustrial PC + Motion Control Card
ProgrammingOnline visual programming
CCD VisionAutomatic calibration and error correction
X/Y/Z DriveServo motor + precision grinding screw
Max Movement Speed1000mm/s
Repeat Accuracy±0.01mm
Dispensing ItineraryX=400mm, Y=400mm, Z=50mm
Component Height50mm max
Dispensing Valve1x H-Y01 piezoelectric jet valve
Material Capacity30CC / 50CC
Track Width50-400mm (automatic adjust)
Conveyor Speed0.5-3.5m/min adjustable
Air Pressure6.2kgf/cm²
Power Supply220V 50-60Hz
Total Power3KW
InterfaceSMEMA
Alarm SystemMenu display + sound/light alarm
Applications
  • Underfill for flip chips and BGAs
  • Precision adhesive dispensing
  • Encapsulation and dam & fill
  • Solder paste jetting
  • Thermal interface material application
  • Camera module assembly
  • MEMS and sensor packaging
  • High-precision electronics assembly


Industry Keywords Tag Cloud :


Core Equipment Terms: Automated Dispensing Machine, Fluid Dispensing Robot, Automatic Glue Dispenser, Selective Fluid Dispensing System, Inline Dispensing Machine, PCB Dispensing Equipment, PCBA Glue Dispenser, Tabletop Dispensing Robot, Dual-Component Dispensing System


Fluid Control Automation Processing & Technology Keywords: Precision Dispensing, Jet Dispensing, Needle Dispensing, Micro-Dispensing Technology, Potting Process, Encapsulation System, Underfill Dispensing, Dam and Fill, Silicone Sealing, Thermal Interface Material Application


Glue Volume Calibration Material Compatibility Keywords: Silicone Adhesive, Epoxy Resin, Polyurethane Glue, UV Curable Adhesive, Cyanoacrylate, Thermal Conductive Paste, Conductive Silver Epoxy, Two-Part Adhesive, Solvent-Free Glue, Protective Polymeric


Material Manufacturing & Application Keywords: PCB Assembly, SMT Production Line, Semiconductor Packaging, Electronics Manufacturing, LED Encapsulation, Automotive Electronics Assembly, Sensor Sealing, Camera Module Bonding, Smart Device Components Protection


Industrial Control Module Potting Performance & Inspection Keywords: High Precision Dispensing, Non-Contact Jetting, High-Speed Fluid Deposition, Dynamic Weight Calibration, Laser Height Sensor, Vision Alignment System, CCD Positioning, Automatic Nozzle Cleaning, Closed-Loop Fluid Control


Industry 4.0 Smart Dispensing Quality & Curing Keywords: Dispensing Quality Control, Glue Line Inspection, Automated Optical Inspection, Defect Detection, UV Curing Process, Thermal Curing Line, Process Verification, Quality Assurance, Turnkey Dispensing Solution, Smart Production Line Integration

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