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Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling
Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling
Categories Waffle Pack Chip Trays
Brand Name: Hiner-pack
Model Number: HN24146
Certification: ROHS, ISO
Place of Origin: China
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Delivery Time: 10 workdays
Packaging Details: CARTON, PALLET
Tray Weight: Varies, Typically Up To 500 Grams Per Cavity
Color: Black
Quality Assurance: Delivery Guarantee, Reliable Quality
Outline Line Size: 50.8×50.8×4.36 mm
Cavity Size: 1.08x1.08x2.18 mm
Incoterms: EXW, FOB, CIF, DDU, DDP
Mold Type: Injection
Reusable: Yes
Tray Shape: Rectangular
Clean Class: General And Ultrasonic Cleaning
Ic Type: BGA,QFP,QFN,LGA,PGA
Packing Level: Transport package
Warpage: Warpage MAX 0.26mm
Capacity: 15x15=215 PCS
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Company Info.
Shenzhen Hiner Technology Co., Ltd.
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Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

High-Precision Cleanroom Waffle Pack IC Trays adopt dense precise grid cavity structure, meeting strict cleanroom industry standards.


With excellent contamination control & dust-proof performance, the trays provide stable safe handling, storage and transportation protection for delicate ESD-sensitive fine pitch semiconductor IC chips.


They are perfectly suitable for semiconductor manufacturing, packaging, inspection & testing processes, and support fully customized cavity size & layout designs to match various chip specifications.

Key Features/ Benefits
  • Anti-static & dust-proof design for safe chip handling
  • High-precision compact grid cavity structure
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
BrandHiner-pack
ModelHN24146
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size50.8×50.8×4.36 mm
Cavity Size1.08x1.08x2.18 mm
Matrix QTY15x15=215 PCS
WarpageMAX 0.26mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Cleanroom-grade Waffle Pack IC Trays provide full protection for semiconductor chips with contamination control & ESD anti-static performance.
  • Fine pitch IC packaging (QFN, BGA, CSP bare die)
  • JEDEC compatible automated pick-and-place lines
  • Semiconductor inspection & testing processes
  • Cleanroom IC logistics transportation & storage management
Packaging & Shipping/ Services
Our high-precision JEDEC trays are packaged in durable, ESD-safe anti-static materials with secure interlocking stacking design and shock-absorbing cushioning inserts, ensuring maximum protection against physical damage, electrostatic discharge, and contamination during transit and storage.

All shipments are fully tracked and handled by trusted global logistics carriers, ensuring reliable, on-time worldwide delivery to your facility. We provide flexible shipping options to meet your urgent production needs, including expedited shipping for rush orders, and comprehensive shipping documentation to streamline customs clearance for international orders.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers
Product Tags:

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Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

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