Name: ESD Anti Static Semiconductor Waffle Chip Trays
Brand: Hiner-pack
Price: 1.35 USD

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ESD Anti Static Semiconductor Waffle Chip Trays

Categories	Waffle Pack Chip Trays
Brand Name:	Hiner-pack
Model Number:	HN24171
Certification:	ROHS, ISO
Place of Origin:	China
MOQ:	500 pcs
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day
Delivery Time:	10 workdays
Packaging Details:	CARTON, PALLET
Tray Weight:	Varies, Typically Up To 500 Grams Per Cavity
Color:	Black
Quality Assurance:	Delivery Guarantee, Reliable Quality
Outline Line Size:	50.8×50.8×3.94 mm
Cavity Size:	4.64x4.22x0.755 mm
Incoterms:	EXW, FOB, CIF, DDU, DDP
Mold Type:	Injection
Reusable:	Yes
Tray Shape:	Rectangular
Clean Class:	General And Ultrasonic Cleaning
Ic Type:	BGA,QFP,QFN,LGA,PGA
Packing Level:	Transport package
Warpage:	Warpage MAX 0.2mm
Capacity:	6x7=42 PCS

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Company Info.

Shenzhen Hiner Technology Co., Ltd.

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Product Details
Company Profile

ESD Anti Static Semiconductor Waffle Chip Trays

Provide stable anti-static protection for semiconductor IC chips. Bear 125℃ high-temperature working environment. Adopt precise cross-type waffle structure to fix chips firmly and avoid collision damage. Meet strict electronic packaging industry standards. Need reliable chip storage solutions for electronic manufacturing?

Apply to semiconductor packaging testing links. Serve IC die sorting, wafer packaging and chip transportation storage scenarios. Fit integrated circuit component processing and electronic factory production lines perfectly.

Support electronic component turnover and vacuum packaging applications. Offer full custom waffle structure, cavity size and material modification services. Realize personalized tray design according to different chip models and customer requirements. Become your exclusive semiconductor packaging storage partner.

Key Features/ Benefits

Deliver effective ESD anti-static performance
Stable high-temperature resistance up to 125℃
Suitable for Delicate Fine Pitch ICs
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24171
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×3.94 mm
Cavity Size		4.64x4.22x0.755 mm
Matrix QTY		6x7=42 PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Apply to semiconductor packaging, IC chip testing and die sorting processes. Fit wafer processing and electronic component packaging production links perfectly.

Serve chip turnover storage, vacuum packaging and transportation scenarios. Adapt to various integrated circuit manufacturing and electronic assembly industries.

Packaging & Shipping/ Services

Adopt safe anti-pressure outer packaging to protect internal waffle trays. Provide shockproof and dustproof packaging for long-distance transportation. Support customized packaging specifications according to order quantity. Ensure intact tray delivery and stable anti-static performance during logistics.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

ESD Anti Static Semiconductor Waffle Chip Trays

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