Dense cavity JEDEC waffle pack trays meet strict international
semiconductor cleanroom standards. Delivers stable particulate
contamination isolation and professional ESD anti-static
performance, fully protecting fragile fine pitch integrated circuit
components from production damage.
Features uniform precise dense square cavity grid structure. Owns
durable interlocking stackable design, effectively resists dust
pollution, scratch damage and electrostatic interference through
all chip handling and transfer procedures.
Covers full semiconductor packaging, inspection, testing, logistics
transportation and inventory storage scenarios. Maintains long-term
clean and stable status for sensitive high-value IC chips. Supports
fully customized pocket cavity specifications for diversified chip
models.
Cleanroom-grade Waffle Pack IC Trays provide full protection for
semiconductor chips with contamination control & ESD anti-static
performance.
- Fine pitch IC packaging (QFN, BGA, CSP bare die)
- JEDEC compatible automated pick-and-place lines
- Semiconductor inspection & testing processes
- Cleanroom IC logistics transportation & storage management
Our high-precision JEDEC trays are packaged in durable, ESD-safe
anti-static materials with secure interlocking stacking design and
shock-absorbing cushioning inserts, ensuring maximum protection
against physical damage, electrostatic discharge, and contamination
during transit and storage.
All shipments are fully tracked and handled by trusted global
logistics carriers, ensuring reliable, on-time worldwide delivery
to your facility. We provide flexible shipping options to meet your
urgent production needs, including expedited shipping for rush
orders, and comprehensive shipping documentation to streamline
customs clearance for international orders.