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High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling

Categories Silicone Thermal Pad
Brand Name: Ziitek
Model Number: TIF100-15-11S
Certification: UL & RoHS
Place of Origin: China
MOQ: 1000pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
Delivery Time: 3-5 work days
Packaging Details: 24*13*12cm cartons
Products name: High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling
Color: Dark Gray
Dielectric Constant: 4.5 MHz
Keywords: Gap pad filler
Application: Consumer Electronics Cooling
Thickness: 0.25-5.0mmT(0.010"~0.20")
Breakdown Voltage(V/mm): ≥5500
Fire rating: 94 V0
Thermal conductivity: 1.5W/m-K
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  • Product Details
  • Company Profile

High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling

High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling


The TIF®100-15-11S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.


Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Features


> Good thermal conductive: 1.5W/mK
> Available in varies thicknesses
> Broad range of hardnesses available
> Outstanding thermal performance

> Easy release construction
> Electrically isolating
> High durability


Applications


> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board


Typical Properties of TIF®100-15-11S Series
PropertyValueTest method
ColorDark GrayVisual
Construction & CompostionCeramic filled silicone elastomer******
Density(g/cm³)2.3ASTM D792
Thickness Range(inch/mm)0.010~0.0200.030~0.200ASTM D374
(0.25~0.5)(0.75~5.0)
Hardness65 Shore 0045 Shore 00ASTM 2240
Continuos Use Temp-40 to 200℃***
Breakdown Voltage(V/mm)≥5500ASTM D149
Dielectric Constant4.5 MHzASTM D150
Volume Resistivity>1.0X1012 Ohm-meterASTM D257
Thermal Conductivity (W/m-K)1.5ASTM D5470
1.5ISO22007
Fire ratingV-0UL 94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Advantage


Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.


Independent R&D team


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