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| Categories | X Ray Security Scanner |
|---|---|
| Brand Name: | UNICOMP |
| Model Number: | AX8300 |
| Certification: | CE |
| Place of Origin: | China |
| MOQ: | 1Set |
| Price: | can negotiate |
| Payment Terms: | T/T,L/C |
| Supply Ability: | 30 sets per month |
| Delivery Time: | 30 days |
| Packaging Details: | Wooden Case, Waterproof, Anti-collision |
| Navigation And Positioning: | Quickly locate physical images |
| Door Open: | Hand-operated door |
| Detection Area: | 129*129[mm] |
| Frame Rates: | Max30fps |
| Pixel Size: | 84μm |
| Geometric Magnification: | 48.8X (Under Specific Circumstances) |
| Company Info. |
| Unicomp Technology |
| Verified Supplier |
| View Contact Details |
| Product List |
Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance
The AX8300 X-ray inspection system is extensively deployed for circuit board and semiconductor inspection.
As an offline X-ray solution, it is widely adopted in offline testing and defect analysis, ideal for PCBA, semiconductor packaging, ceramics, plastics, LED components and other precision electronic parts.
| System Summary | Dimension | 1215(W)∗1325(D)∗1700(H)mm |
| Machine Weight | 1350kg | |
| Power Supply | 220V±10% 50Hz/60Hz 4A | |
| Power Consumption | 900W | |
| X-Ray Tube | Tube Type | Sealed |
| Voltage | 110kV | |
| Max.Power | 25W | |
| Min.Resolution | 5µm | |
| Other Features | X-Ray Safety | <1µSv/h |
Major applications:
PCBA BGA/IC LED Aliminum die casting Battery connector inspecting
1. Semiconductor package
2. Electronic connector module.
3. Original Package
4. Aerospace components
5. Medical appliances
6. Automation components
Application:
1. BGA/CSP/FLIPS CHIP:
Bridging ,Voids,Opens,Expcessive/insufficient
2. QFN:Bridging,Voids,Opens,Registration
3. SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others
4. Semiconductor:
bond wire,die attach VOID ,MOLD,VOID
5. Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias
Inspection Images

Application Fields

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