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2-Layer RT/duroid 6006 PCB built on 10mil ceramic-PTFE substrate with Immersion Silver Finish

Categories Rogers PCB Board
Brand Name: Rogers
Model Number: RT/duroid® 6006 PCB
Certification: ISO9001
Place of Origin: China
MOQ: 1PCS
Price: 0.99-99USD/PCS
Payment Terms: T/T, Paypal
Supply Ability: 50000pcs
Delivery Time: 2-10 working days
Packaging Details: Packing
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2-Layer RT/duroid 6006 PCB built on 10mil ceramic-PTFE substrate with Immersion Silver Finish

2-Layer RT/duroid® 6006 PCB | 10mil Core | Immersion Silver Finish


Product Overview

We are pleased to present this newly customized 2-layer rigid PCB built on Rogers RT/duroid® 6006 high-frequency laminate. As a ceramic-PTFE composite specifically engineered for electronic and microwave circuit applications requiring a high dielectric constant, this material enables significant circuit size reduction while maintaining excellent electrical performance.



The board is supplied as two types (2 pieces) with dimensions of 134.8mm x 78.65mm per piece, dimensional tolerance of ±0.15mm. Finished board thickness is 0.4mm (including 10mil core + 2 x 35μm copper). Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. No blind vias are used in this construction.


This design features no solder mask and no silkscreen on both sides—an intentional choice to eliminate parasitic losses and ensure optimal RF performance. The Immersion Silver surface finish provides excellent solderability, low contact resistance, and superior RF performance, making it particularly suitable for high-frequency and RF applications. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.


PCB General Specifications

ParameterDetail
Layer Count2-Layer Rigid
Base MaterialRogers RT/duroid® 6006 (Ceramic-PTFE composite)
Board Dimensions134.8mm x 78.65mm (2 types = 2 PCBs) ±0.15mm
Finished Thickness0.4mm
Core Thickness10mil (0.254mm)
Min. Trace / Space5 / 6 mils
Min. Hole Size0.3mm
Blind ViasNone
Finished Cu Weight1 oz (1.4 mils / 35μm) outer layers
Via Plating Thickness20 μm
Surface FinishImmersion Silver
Top Solder MaskNone
Bottom Solder MaskNone
Top SilkscreenNone
Bottom SilkscreenNone
Electrical Test100% prior to shipment
Artwork FormatGerber RS-274-X
Quality StandardIPC-Class-2
AvailabilityWorldwide
Components / Pads / Vias / Nets46 / 64 / 41 / 2

Material Advantages: RT/duroid® 6006

The RT/duroid® 6006 microwave laminates from Rogers Corporation are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. With a Dk value of 6.15, these laminates enable significant circuit size reduction while maintaining excellent high-frequency performance.



Key material highlights:

Ceramic-PTFE composite construction provides a unique balance of electrical and mechanical properties


Tight dielectric constant and thickness control ensures repeatable circuit performance across production lots


Low moisture absorption (0.05%) maintains stable electrical properties in humid environments


Excellent thermal mechanical stability supports reliable operation across a wide temperature range


High thermal decomposition temperature (Td > 500°C) offers exceptional thermal stability


The material is supplied clad both sides with electrodeposited copper foil. The combination of high Dk and low loss makes RT/duroid 6006 ideal for operating at X-band frequencies and below. Standard dielectric thicknesses include 0.010", 0.025", 0.050", 0.075", and 0.100", with additional thicknesses available upon request.


RT/duroid® 6006 Material Properties

PropertyTest ConditionValueBenefit
Dielectric Constant (εr) Process10 GHz / 23°C6.15 ±0.15High Dk enables circuit size reduction
Dielectric Constant (εr) Design8 GHz to 40 GHz6.45Accurate design for broadband applications
Dissipation Factor (tan δ)10 GHz / 23°C0.0027Low loss, ideal for X-band and below
TCDk (Thermal Coefficient of εr)-50°C to +170°C-410 ppm/°CPredictable performance across temperature
Surface ResistivityCOND A7 × 10⁷ MΩClean signal integrity
Volume ResistivityCOND A2 × 10⁷ MΩ·cmHigh insulation resistance
CTE (X-axis)-55°C to +288°C47 ppm/°CDimensional stability
CTE (Y-axis)-55°C to +288°C34 ppm/°CDimensional stability
CTE (Z-axis)-55°C to +288°C117 ppm/°CReliable PTH performance
Thermal Conductivity80°C0.49 W/(m·K)Basic heat dissipation
Moisture AbsorptionD48/50°C, 0.050" thick0.05%Stable in humid environments
Density2.7 g/cm³High ceramic content
Td (Thermal Decomposition)TGA>500°CExcellent thermal stability
Copper Peel StrengthAfter solder float2.5 N/mm (14.3 pli)Reliable copper adhesion
Flammability RatingUL 94V-0Fire safety compliant
Lead-Free Process CompatibleYesReady for modern assembly

PCB Stackup & Construction

The board features a thin, high-performance 2-layer stackup:


Top Copper (Layer 1): 1 oz (35μm) – Electrodeposited copper


Dielectric Core: Rogers RT/duroid® 6006 – 10mil (0.254mm)


Bottom Copper (Layer 2): 1 oz (35μm) – Electrodeposited copper


Total Finished Thickness: 0.4mm


Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 46 components, 64 total pads (26 thru-hole, 38 top SMT), 41 vias, and 2 nets.


Both solder mask and silkscreen are omitted on both sides, preserving the bare dielectric surface for optimal RF performance and minimizing signal loss—critical for high-frequency microwave applications.


Typical Applications

Thanks to its high Dk (6.15), low loss, and stable electrical properties, this PCB is ideally suited for:

Patch antennas

Satellite communications systems

Power amplifiers

Aircraft collision avoidance systems

Ground radar warning systems

Electronic and microwave circuits requiring high dielectric constant


Available Configurations

RT/duroid 6006 laminates are available with standard dielectric thicknesses of 0.010", 0.025", 0.050", 0.075", and 0.100" (0.254, 0.635, 1.270, 1.905, 2.54 mm). Copper cladding options range from ½ oz. to 2 oz./ft² (18 to 70 μm), including standard and reverse-treated electrodeposited copper foil. Thick aluminum, brass, or copper plate on one side may also be specified. Standard panel sizes include 10"x10", 10"x20", and 18"x12", with additional sizes available upon request.


All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.


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