Name: Ag Alloy Bonding Wire For Semiconductor Devices
Brand: WINNER
Price: 999 USD

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Ag Alloy Bonding Wire For Semiconductor Devices

Categories	Bonding Wire
Brand Name:	WINNER
Model Number:	MW001
Certification:	ISO9100
Place of Origin:	CHINA
MOQ:	1PC
Price:	999
Payment Terms:	L/C,Western Union,T/T
Supply Ability:	100000 rolls per month
Delivery Time:	5-8 WORKING DAYS
Packaging Details:	Roll, Neutrial Packing or with OEM LOGO
Product Type:	Bonding Wire
Material:	Ag
Package:	Spool
Surface Finish:	Bright
Conductivity:	98%
Application:	Semiconductor Packaging, Microelectronics, Medical Devices

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SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

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Ag Alloy Bonding Wire For Semiconductor Devices

Product Description

Silver (Ag) alloy bonding wires have excellent electrical and thermal conductivity. They are also effective wires for optical semiconductor devices such as LEDs as they have high reflectivity in the visible spectrum. In addition, as an alternative material for gold (Au) wires, costs can be reduced by approximately 80%.

Features

Reduce material cost with good bondability
High reflectivity in short wavelength range
Low Resistivity (SEC Type)
Soft FAB (SEC type)

Close-up view of high purity gold wire showing plating quality and surface texture

Gold wire spool showing professional packaging and product storage

Microscopic cross-section view of gold wire showing uniform structure and purity

Gold wire being used in precision industrial application with specialized equipment

Product Tags:

Ag alloy semiconductor bonding wire

bonding wire for semiconductor devices

silver alloy bonding wire

Ag Alloy Bonding Wire For Semiconductor Devices

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