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Rogers 3010 PCB Double-layer 20mil RF laminate with Immersion Silver

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-200.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: RO3010
Layer count: 2-layer
PCB thickness: 0.5mm
PCB size: 102mm x 63mm per unit
Copper weight: 1 oz (1.4 mils) on outer layers
Surface finish: Immersion Silver
Solder mask: No
Silkscreen: No
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Rogers 3010 PCB Double-layer 20mil RF laminate with Immersion Silver

This 2-layer rigid printed circuit board (PCB) is constructed using Rogers RO3010 as its core substrate and features an Immersion Silver surface finish. Equipped with a 1oz (1.4 mils) copper weight on the outer layers, a finished board thickness of 0.5mm, and a via plating thickness of 20 μm, the PCB delivers stable electrical performance and precise manufacturing quality, making it highly suitable for a broad range of high-frequency and wireless electronic applications.


PCB Specifications

SpecificationsDetails
Base materialRO3010
Layer count2-layer
Board dimensions102mm x 63mm per unit
Minimum Trace/Space5/7 mils
Minimum Hole Size0.4mm
Blind vias / buried viasNot included
Finished board thickness0.5mm
Finished Cu weight1 oz (1.4 mils) on outer layers
Via plating thickness20 μm
Surface finishImmersion Silver
Top SilkscreenNot used
Bottom SilkscreenNot used
Top Solder MaskNot used
Bottom Solder MaskNot used
Quality control100% electrical testing performed before shipment

PCB Stack-up

Stack-up LayerSpecification
Copper_layer_135 μm
Rogers RO3010 Substrate20 mil (0.508mm)
Copper_layer_235 μm


Artwork Type

The artwork provided for PCB manufacturing complies with the Gerber RS-274-X format, the industry-standard protocol for transmitting PCB fabrication data.


Quality Standard

This PCB meets the IPC-Class-2 standard, a widely recognized industry benchmark for printed circuit boards. IPC-Class-2 defines the requirements for PCB quality, performance, and reliability, making it appropriate for most commercial and industrial applications that demand consistent performance and moderate reliability.


Availability

This PCB is available worldwide. We provide dependable logistics and shipping services to ensure timely delivery to customers in various countries and regions, supporting both small-batch and large-volume orders. Whether for regional electronic companies, research institutions, or global technology enterprises, we offer consistent supply and professional after-sales support to meet diverse market requirements.


Introduction to RO3010 Base Material

Rogers RO3010 advanced circuit materials are ceramic-filled PTFE composites that provide a higher dielectric constant with superior stability. As cost-effective products, they offer exceptional mechanical and electrical stability, which simplifies the design of broadband components and enables their use in a wide array of applications across an extensive frequency range. The inherent characteristics of this material make RO3010 laminates highly suitable for circuit miniaturization.


Key Features of RO3010

Key FeaturesSpecifications
Dielectric Constant (Dk)10.2 +/- 0.30 at 10 GHz/23°C
Dissipation Factor0.0022 at 10 GHz/23°C
Coefficient of Thermal Expansion (CTE)13 ppm/°C (X-axis), 11 ppm/°C (Y-axis), 16 ppm/°C (Z-axis) (-55 to 288 °C)
Td Value> 500°C
Thermal Conductivity0.95 W/mK
Moisture Absorption0.05%
Operating Temperature Range-40℃ to +85℃

Benefits

-The material demonstrates excellent dimensional stability, with a thermal expansion coefficient compatible with copper


-Competitive pricing for laminates, making it ideal for high-volume manufacturing processes


-ISO 9001 Certified, ensuring consistent quality and reliable performance


-Compatible with multi-layer board designs, providing versatile application capabilities


Typical Applications

  • Automotive radar applications
  • Global positioning satellite antennas
  • Cellular telecommunications systems – power amplifiers and antennas
  • Patch antennas for wireless communications
  • Direct broadcast satellites
  • Datalinks on cable systems
  • Remote meter readers
  • Power backplanes

Conclusion

This PCB is well-suited for professionals, organizations, R&D institutions, and technology enterprises involved in automotive radar, GPS antennas, cellular telecommunications, and other wireless/high-frequency equipment manufacturing. With global availability, rigorous pre-shipment electrical testing, and flexible order support, it meets the specialized high-performance needs of electronic enterprises worldwide, serving as a reliable solution for high-demand applications by leveraging the high-performance RO3010 material.


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