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Double-Sided Aluminum PCB with Immersion Gold

Categories Metal Core PCB
Brand Name: Bicheng
Model Number: BIC-200.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Aluminum
Layer count: Double-Sided
PCB thickness: 1.65mm ± 10%
PCB size: 68mm × 54mm
Copper weight: 1oz
Surface finish: Immersion Gold (ENIG), 2u" Gold Thickness
Solder mask: Green
Silkscreen: No
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Double-Sided Aluminum PCB with Immersion Gold

This printed circuit board (PCB) features a double-sided sandwich aluminum substrate configuration, specifically engineered for high-heat-dissipation applications. It adheres to strict dimensional and performance criteria to fulfill the operational requirements of high-reliability electronic systems.


PCB Specifications

Construction ParameterSpecification
PCB TypeDouble-Sided Sandwich Aluminum PCB
Thermal Conductivity> 2 W/mK
Finished Board Thickness1.65mm ± 10%
Copper Thickness1oz
Surface FinishImmersion Gold (ENIG), 2u" Gold Thickness
Solder MaskDouble-sided Green Solder Mask
Board Dimensions68mm × 54mm


What is a Metal Core Printed Circuit Board (MCPCB)?

A Metal Core Printed Circuit Board (MCPCB) is a specialized type of PCB that utilizes a metal substrate—most commonly aluminum, though copper or iron may also be used—as its core, replacing the traditional FR-4 insulating substrate. Its primary function is to enhance heat dissipation, addressing the issue of heat buildup in high-power electronic components such as LEDs and power amplifiers. Acting as a heat conductor, the metal core efficiently transfers heat generated by components to an external heat sink, thereby improving component reliability and extending their service life. In comparison to conventional PCBs, MCPCBs offer superior thermal conductivity, mechanical strength, and electromagnetic shielding capabilities.


Differences Between Double-Layer Sandwich Aluminum Substrate and Double-Layer Single-Side Aluminum Substrate

Double-Layer Sandwich Aluminum Substrate

Structural Features: The core of this substrate is a layer of aluminum. Insulating layers (e.g., PP, PI) are attached to both the upper and lower surfaces of the aluminum core, with a layer of copper foil pressed onto the outer side of each insulating layer to form two separate upper and lower circuit layers.

LayerTypeMaterialThickness (mm)Remarks
1Solder MaskSolder Mask0.015Top Protective Layer
2Copper FoilCopper0.035Top Circuit Layer
3Prepreg2W/MK Prepreg0.075High Thermal Conductivity Dielectric Layer
4Metal SubstrateAluminum Core1.4Metal Substrate Core, Main Thermal Conductive Layer
5Prepreg2W/MK Prepreg0.075High Thermal Conductivity Dielectric Layer
6Copper FoilCopper0.035Bottom Circuit Layer
7Solder MaskSolder Mask0.015Bottom Protective Layer
Total Thickness--1.65Total Thickness After Lamination


Simple Understanding: The aluminum core is positioned in the middle, with circuit layers on both sides—similar to a "sandwich cookie," where the aluminum serves as the filling and the two copper layers act as the cookie layers. Both sides can conduct heat to the aluminum core, enabling uniform heat dissipation across the entire board.


Double-Layer Single-Side Aluminum Substrate

Structural Features: Unlike the sandwich structure, this type of substrate only has an aluminum substrate on one side to serve as the heat dissipation layer, while the other side is made of ordinary insulating materials such as FR-4. Although it has two copper foil layers (located on the top first and second layers), only the side with the aluminum substrate can effectively conduct heat to the aluminum core.


LayerTypeMaterialThickness (mm)Remarks
L1Copper FoilCopper0.07Top Circuit Layer, Through-hole Connection
-Dielectric Layer2W/MK Prepreg0.12High Thermal Conductivity Material
L2Copper FoilCopper0.07Bottom Circuit Layer, Through-hole Connection
-Dielectric Layer2W/MK Prepreg0.12High Thermal Conductivity Material
-Metal SubstrateAluminum Core2.8Lamination Thickness, Main Thermal Conductive Layer
Total Thickness--3.18Total Thickness After Lamination


Simple Understanding: Aluminum is only present on one side of the board, and the opposite side does not contribute to heat dissipation. It can be visualized as a "double-layer board with aluminum on one side," where the heat dissipation effect is limited to the side containing the aluminum core.


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