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High Temp JEDEC Tray With ESD Protection

High Temp JEDEC Tray With ESD Protection

High Temp JEDEC Tray With ESD Protection
High Temp JEDEC Tray With ESD Protection
Categories JEDEC IC Trays
Brand Name: Hiner-pack
Model Number: HN24220
Certification: ROHS, ISO
Place of Origin: China
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Delivery Time: 10 workdays
Packaging Details: CARTON, PALLET
Tray Weight: Varies, Typically Up To 500 Grams Per Cavity
Color: Usually black or dark gray for ESD protection
Quality Assurance: Delivery Guarantee, Reliable Quality
Cavity Size: 4x5x1.6 mm
Incoterms: EXW, FOB, CIF, DDU, DDP
Mold Type: Injection
Reusable: Yes
Tray Shape: Rectangular
Clean Class: General And Ultrasonic Cleaning
Ic Type: BGA,QFP,QFN,LGA,PGA
Packing Level: Transport package
Flatness: Less than 0.76mm
Capacity: 13x28=364 PCS
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Company Info.
Shenzhen Hiner Technology Co., Ltd.
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High Temp JEDEC Tray With ESD Protection

High Temp JEDEC Tray with ESD Protection
This JEDEC tray is specially designed for high-temperature semiconductor processes, including wafer baking, burn-in testing, reflow soldering, and AI chip packaging. Made from premium PEI material, it delivers exceptional dimensional stability and precise chip positioning, ensuring seamless compatibility with automated handling equipment throughout production, storage, and transportation, while effectively protecting sensitive ICs, BGA packages, and high-value AI chips from electrostatic damage.
Our JEDEC trays are manufactured in strict compliance with JEDEC industry standards, featuring ultra-low warpage and long-term dimensional accuracy even after repeated high-temperature cycles. We offer free custom design services with a 24-hour turnaround for non-standard sizes and configurations, supporting bulk orders with fast lead times to meet the production needs of semiconductor manufacturing enterprises.
Key Features/ Benefits
  • Heat Resistance up to 150°C
  • Stable ESD protection (1E4–1E11 Ω)
  • Compatible with ASM / Advantest / YAMAHA machines
  • Low Warpage & High Dimensional Stability
  • JEDEC standard footprint
Specifications
BrandHiner-pack
ModelHN24220
MaterialMPPO
Package TypeJEDEC
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size322.6×135.9×7.62 mm
Cavity Size4x5x1.6 mm
Matrix QTY13x28=364 PCS
WarpageMAX 0.76mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.
  • AI chips / GPU / ASIC
  • BGA / QFN / IC packaging
  • Burn-in & baking process
  • Production line buffering
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • 10+ years semiconductor packaging experience
  • In-house mold design capability
  • OEM & ODM customization supported
  • Consistent quality and stable supply
  • Daily capacity: 2000+ pcs
Product Tags:

180°C high temp JEDEC tray

  

ESD protection JEDEC IC tray

  

semiconductor packaging JEDEC tray

  
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High Temp JEDEC Tray With ESD Protection

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