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Laser Scribing Edge Cleaning Cutting And Breaking Machine For Perovskite Layer

Categories Photovoltaic Laser Equipment
Brand Name: UW
Certification: CE ISO
MOQ: 1set
Price: Negotiation
Packaging Details: carton box/wooden box
Payment Terms: T/T
Applicable Size: Customizable according to product size
Laser: Cutting: UW-Ps-100; Splitting: UW-915-200
Applicable Thickness: 1-8 mm (customizable)
Machine Dimensions: 1800*1400*2300mm
Loading & Unloading Method: Manual loading & unloading, connectable with upper and lower production lines
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Laser Scribing Edge Cleaning Cutting And Breaking Machine For Perovskite Layer

Equipment Introduction

Adopting self-developed lasers and optical path structures, this equipment is designed for scribing perovskite and edge cleaning of the perovskite layer. It first uses ultrafast laser for cutting and modification, followed by CO₂ laser for wafer separation, achieving high-quality processing with no chipping and no cracks.


Highlights

・Adopts self-developed picosecond laser for cutting and self-developed semiconductor laser for splitting, equipped with an integrated UW cutting & splitting optical output head.

・The whole machine features a modular and flexible design with simple operation.

・Equipped with an auto-focusing and alignment vision module for accurate identification and positioning.

・Extremely minimal chipping after splitting, no micro-cracks, high cutting quality and high processing efficiency.


Technical Parameters

Equipment PerformanceSpecifications
Operation ModeCompatible with both manual and automatic production modes
Applicable SizeCustomizable according to product size
LaserCutting: UW-Ps-100; Splitting: UW-915-200
Optical SystemEquipped with UW self-developed integrated cutting & splitting optical output head
Applicable Thickness1-8 mm (customizable)
Loading & Unloading MethodManual loading & unloading, connectable with upper and lower production lines
Chipping Size<5μm
Straightness±5μm
Machine Dimensions1800*1400*2300mm

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