TLX-8 DK value 2.55 Double sided Copper Clad Laminate with Reverse treated (RTF) copper

TLX-8 Copper Clad Laminate: The Workhorse for High-Volume Microwave Applications

AGC introduces the TLX-8, a high-volume fiberglass reinforced PTFE microwave substrate engineered for reliability across a wide range of RF applications. With a proven space heritage and exceptional performance characteristics, TLX-8 has earned its reputation as a workhorse in the RF microwave substrate world—ideal for applications where mechanical reinforcement, environmental resistance, and consistent electrical performance are critical.

Electrical Performance
The TLX-8 features a dielectric constant (Dk) of 2.55 ±0.04 at 10 GHz, offering tight control that enables precise impedance matching and repeatable circuit performance. The dissipation factor (Df) is 0.0018 at 10 GHz, ensuring low signal loss for efficient power transmission.

Key electrical highlights include:

Excellent PIM Performance: Measured at lower than -160 dBc (tested with 20 watts per channel at 800 and 1800 MHz), making TLX-8 ideal for passive components and antenna systems

• Surface Resistivity: 6.605 × 10⁸ Mohm (elevated temperature) and 3.550 × 10⁶ Mohm (humidity condition)
• Volume Resistivity: 1.110 × 10¹⁰ Mohm/cm
• Dielectric Breakdown: >45 kV, providing robust insulation

Environmental Resilience
TLX-8 is designed to withstand severe environments where many substrates would fail:

• Space Heritage: Long history of successful space applications with low outgassing properties (TML: 0.03%, CVCM: 0.00%, WVR: 0.01% per ASTM E 595)
• Vibration Resistance: Excellent creep resistance for PWBs bolted to housings experiencing high vibration during space launch
• High Temperature Exposure: Suitable for engine module applications
• Radiation Resistance: Proven performance in space environments
• Marine Environment: Resistant to extreme conditions for warship antennas
• Wide Temperature Range: Stable performance for altimeter substrates during flight with only ±2% Dk variation from -55°C to 125°C

Thermal Performance:

• Coefficient of Thermal Expansion (CTE): 21 ppm/°C (X), 23 ppm/°C (Y), 215 ppm/°C (Z) from 25°C to 260°C
• Thermal Conductivity: 0.19 W/(m·K)
• Decomposition Temperature (Td): 535°C (2% weight loss), 553°C (5% weight loss)
• Moisture Absorption: Only 0.02%, ensuring stable performance in humid environments

Mechanical Properties:

Peel Strength: 2.63 N/mm (15 lbs/in) for 1 oz ED copper; 2.98 N/mm (17 lbs/in) for 1 oz RTF copper

Young's Modulus: 6,757 N/mm² (MD) and 8,274 N/mm² (CD) per ASTM D902

Dimensional Stability: 0.06-0.10 mm/m after thermal stress testing

Flammability Rating: UL 94 V-0

Versatile Applications For TLX-8

Antennas (including phased array and warship antennas)

Mixers, splitters, filters, and combiners

Passive components

Radar systems

Mobile communication systems

Microwave test equipment and transmission devices

Low layer count microwave designs

Processing and Fabrication
As a woven fiberglass reinforced PTFE laminate, TLX-8 offers excellent processability:

Standard PTFE Processing: Compatible with conventional fabrication techniques

Mechanical Processing: Easily sheared, drilled, and milled

Plated Through-Holes: Reliable via processing with standard methods

Dimensional Stability: Excellent stability throughout fabrication

Copper Options: Available with electrodeposited (ED), reverse treated (RTF), and rolled copper foils

Dielectric Thickness:

Range: 0.0025" to 0.250" (0.064mm to 6.35mm)

Available in 0.005" (0.125mm) increments

Standard Panel Sizes:

12" × 18" (305mm × 457mm)

16" × 18" (406mm × 457mm)

18" × 24" (457mm × 610mm) — standard size

16" × 36" (406mm × 914mm)

24" × 36" (610mm × 914mm)

18" × 48" (457mm × 1,220mm)

36" × 48" (914mm × 1,220mm)

Copper Cladding Options:

Electrodeposited (ED) copper: ½ oz. and 1 oz.

Reverse treated (RTF) copper: 1 oz.

Rolled copper: 1 oz.

Production Capabilities and Supply Chain

High-Volume Production: Scalable manufacturing for both prototype and high-volume requirements

Precision Manufacturing: Advanced PTFE processing technologies with tight process control

Quality Assurance: All test data provided as typical values; critical specifications available upon request

Custom Configurations: Additional thicknesses, panel sizes, and claddings available—contact AGC for details

Storage Requirements:

• Store in a clean, dry environment at 10°C to 35°C
• Maintain relative humidity below 70%
• Keep in original packaging until ready for use
• Avoid direct sunlight, corrosive gases, and extreme temperature fluctuations
• Store panels flat to prevent warpage
• Recommended shelf life: 12 months under proper conditions

Transportation:

• Protective interleaving prevents surface damage
• Secure edge protection minimizes transit damage
• Moisture-barrier packaging available for humidity-sensitive shipments
• Multiple packaging options for domestic and international shipping

Why Choose TLX-8?
With its proven space heritage, exceptional environmental resilience, excellent PIM performance, and wide range of available configurations, TLX-8 is the reliable choice for engineers seeking a high-volume microwave substrate that performs consistently across demanding applications. Its combination of mechanical reinforcement, thermal stability, and electrical precision makes it a true workhorse in the RF industry.

Contact us today to discuss how TLX-8 can meet your specific high-frequency design requirements.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. The circuit board ranges from conventional FR-4 to PTFE, metal core to flexible circuits which are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

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