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Digital Isolation Solutions Including Broadcom HCPL 902J 500E for Peripheral Interface Applications

Categories Digital Isolators
CMTI(kV/us): 18kV/us
Default Output: -
Number of Forward Channels: 3
Number of Reverse Channels: 1
Operating Temperature: -40℃~+100℃
Description: SOIC-16-300mil Digital Isolators RoHS
Mfr. Part #: HCPL-902J-500E
Model Number: HCPL-902J-500E
Package: SOIC-16-300mil
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Digital Isolation Solutions Including Broadcom HCPL 902J 500E for Peripheral Interface Applications

Broadcom HCPL-90xx / HCPL-09xx High-Speed Digital Isolators

Product Overview

The Broadcom HCPL-90xx and HCPL-09xx series are high-speed CMOS digital isolators designed for robust performance and excellent transient immunity. Featuring a symmetric magnetic coupling barrier, these isolators offer industry-leading speed with a typical pulse width distortion of 2 ns, a typical propagation delay skew of 4 ns, and a data rate of 100 Mbaud. Available in various channel configurations (single, dual, and quad) and package types, they are ideal for isolating data conversion devices, parallel buses, peripheral interfaces, and digital fieldbus applications. They operate across a wide temperature range of 40C to +100C.

Product Attributes

  • Brand: Broadcom
  • Technology: CMOS Digital Isolators
  • Certifications: UL1577, IEC 61010-1

Technical Specifications

Model SeriesChannel ConfigurationPackage TypeData RatePulse Width Distortion (Typ.)Propagation Delay Skew (Typ.)Isolation Voltage (RMS)Operating Temperature
HCPL-90xx / HCPL-09xxSingle8-pin PDIP (300 Mil), 8-pin SOIC100 Mbaud2 ns4 ns2500V-40C to +100C
HCPL-90xx / HCPL-09xxDual (Unidirectional)8-pin DIP (300 Mil), 8-pin SOIC100 Mbaud2 ns4 ns2500V-40C to +100C
HCPL-90xx / HCPL-09xxDual (Bidirectional)8-pin DIP (300 Mil), 8-pin SOIC100 Mbaud2 ns4 ns2500V-40C to +100C
HCPL-90xx / HCPL-09xxQuad (Unidirectional)16-pin SOIC Wide Body, 16-pin SOIC Narrow Body100 Mbaud2 ns4 ns2500V-40C to +100C
HCPL-90xx / HCPL-09xxQuad (2 channels one direction, 2 opposite)16-pin SOIC Wide Body, 16-pin SOIC Narrow Body100 Mbaud2 ns4 ns2500V-40C to +100C
HCPL-90xx / HCPL-09xxQuad (1 channel one direction, 3 opposite)16-pin SOIC Wide Body, 16-pin SOIC Narrow Body100 Mbaud2 ns4 ns2500V-40C to +100C

Key Features

  • +3.3V and +5V TTL/CMOS compatible
  • 3 ns max. pulse width distortion
  • 6 ns max. propagation delay skew
  • 15 ns max. propagation delay
  • High speed: 100 MBd
  • 15 kV/s min. common mode rejection
  • Tri-state output (HCPL-9000/-0900)
  • 2500V RMS isolation

Applications

  • Digital fieldbus isolation
  • Multiplexed data transmission
  • Computer peripheral interface
  • High-speed digital systems
  • Isolated data interfaces
  • Logic level shifting

Electrical Specifications (Typical @ +25C, VDD1 = VDD2 = +3.3V)

ParameterSymbolMin.Typ.Max.UnitTest Conditions
Quiescent Supply Current 1IDD1-0.008 (HCPL-9000/-0900)0.01 (HCPL-9000/-0900)mAVIN = 0V
Quiescent Supply Current 2IDD2-3.3 (HCPL-9000/-0900)4.0 (HCPL-9000/-0900)mAVIN = 0V
Logic Input CurrentIIN-10-10A-
Logic High Output VoltageVOHVDD2 0.1-VDD2VIOUT = 20 A, VIN = VIH
Logic Low Output VoltageVOL-00.1VIOUT = 20 A, VIN = VIL

Switching Specifications (Typical @ +25C, VDD1 = VDD2 = +3.3V)

ParameterSymbolMin.Typ.Max.UnitTest Conditions
Maximum Data Rate-100110-MBdCL = 15 pF
Propagation Delay Time to Logic Low OutputtPHL-1218ns-
Propagation Delay Time to Logic High OutputtPLH-1218ns-
Pulse Width Distortion|PWD|-23ns|tPHL tPLH|
Propagation Delay SkewtPSK-46ns-
Common Mode Transient Immunity|CMH|, |CML|1518-kV/sVcm = 1000V

Package Characteristics

ParameterSymbolMin.Typ.Max.UnitTest Conditions
Capacitance (Input-Output)CI-O-1.1 (Single Channel)-pFf = 1 MHz
Barrier Resistance || Capacitance->10143-|| pF-
Creepage Distance (External)-4.03 (16-Pin SOIC Narrow)--mm-
Leakage Current--0.2-A240 Vrms, 60 Hz

Package Outline Drawings

Refer to the datasheet for detailed package outline drawings for 8-pin PDIP, 8-pin Gull Wing, 8-pin SOIC, and 16-pin SOIC (narrow and wide body) packages.

Handling Precautions

Take normal static precautions in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. The components featured in this data sheet are not to be used in or aerospace applications or environments.


2411271956_Broadcom-HCPL-902J-500E_C6873793.pdf

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