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Coupling and wave filtering capacitor AIDE CAPACITOR 0805X7R101K500NT multi layer ceramic for switch power circuits

Coupling and wave filtering capacitor AIDE CAPACITOR 0805X7R101K500NT multi layer ceramic for switch power circuits

Coupling and wave filtering capacitor AIDE CAPACITOR 0805X7R101K500NT multi layer ceramic for switch power circuits
Coupling and wave filtering capacitor AIDE CAPACITOR 0805X7R101K500NT multi layer ceramic for switch power circuits
Categories Ceramic Capacitors
Voltage Rating: 50V
Capacitance: 100pF
Temperature Coefficient: X7R
Tolerance: ±10%
Description: 100pF ±10% 50V Ceramic Capacitor X7R 0805
Mfr. Part #: 0805X7R101K500NT
Model Number: 0805X7R101K500NT
Package: 0805
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Beijing Silk Road Enterprise Management Services Co., Ltd.
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Coupling and wave filtering capacitor AIDE CAPACITOR 0805X7R101K500NT multi layer ceramic for switch power circuits

Product Overview

This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications, including coupling, wave filtering, and resonance in circuits such as switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These components are suitable for medium and high voltage applications.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • RoHS/REACH Compliance: Meets standards

Technical Specifications

ItemDescription/SpecificationTesting Method
Application Field
Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC).
Testing Conditions
Normal ConditionTemperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPaN/A
Relative ConditionTemperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPaN/A
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225N/A
2. Temperature CharacteristicC0G (030 PPM/), X7R (15%), X5R (15%)N/A
3. Nominal Electrostatic Capacity8R0=8.0pF, 100=10pF, 101=100pFN/A
4. Tolerance of Electrostatic CapacityB:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%N/A
5. Rated Voltage (DC)250=25V, 251=250V, 252=2500VN/A
6. Terminal CompositionAu/Ag-Ni-Sn (From the inside out)N/A
7. PackingT: Tape/Reel, P: Bag packing (PE)N/A
Construction and Dimension
Dimensions (mm)Part numberLWTWB
0201 (0603)0.600.100.300.050.300.050.100.05
0402 (1005)1.000.150.500.150.500.100.200.10
0603 (1608)1.600.200.800.150.800.150.300.10
0805 (2012)2.000.201.250.200.800.200.500.20
1206 (3216)3.200.301.600.301.000.200.600.30
1210 (3225)3.200.302.500.302.700.800.30
1808 (4520)4.500.402.000.202.700.800.30
1812 (4532)4.500.403.200.303.500.800.30
1825 (4563)4.500.406.300.503.500.800.30
2220 (5750)5.700.505.000.503.501.000.40
2225 (5763)5.700.506.300.506.201.000.40
Specification and Testing Method
1. Temperature-55~+125N/A
2. Visual/Dimension1. No Damage, 2. Dimension meet SpecNaked eye (Visual inspection), Digital calliper
3. Static CapacityMeet standard specification and toleranceNPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF).
4. Dissipation Factor (DF)NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 1MHz10%, 1V0.2rms. Cr1000pF, 1KHz10%, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. See Note 1 for exceptions.N/A
5. IR Insulation ResistanceNPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF.Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
6. Hi-pot (DC)No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage.Voltage Raising time: 110S, Voltage maintaining time: 2S
7. SolderabilitySoldering area 90%Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
8. Resistance to the heat of solderingNo visual damage, soldering area 90%Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
9. Electrostatic capacity change rateNPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%.N/A
10. Flexural strengthNo damage. Electro static capacity change rate C/C10%.Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
11. Terminal bonding strengthNo visual damageApplied Force: 5N, Duration: 101S
12. Thermal shockNPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%.Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.
13. Temperature moisture exposureVisual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading).Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity.
14. High temperature exposureVisual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading).Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature.
15. PCB flexural strengthNo crack and other defectIR Soldering the MLCC on the PCB, then pressing direction based on the photo.
Embossed Plastic Taping Dimensions (mm)
CodeTape sizeABCDEFGHJT
08051.55 0.202.35 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.50 Max
12061.95 0.203.60 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.11.50 -0/+0.101.85 Max
12102.70 0.103.42 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.55 -0/+0.103.2 Max
18082.20 0.104.95 0.1012.00 0.105.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.50 -0/+0.103.0 Max
18123.66 0.104.95 0.1012.00 0.105.50 0.051.75 0.108.00 0.102.00 0.054.00 0.101.55 -0/+0.104.0 Max
Paper Tape Reel Packing Dimensions (mm)
CodePaper sizeW1L1DCBP1P2P0dt
10050.24 0.020.45 0.028.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.30 Below
02010.37 0.100.67 0.108.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.80 Below
04020.65 0.101.15 0.108.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.80 Below
06031.10 0.101.90 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
08051.45 0.152.30 0.158.0 0.153.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
12061.80 0.203.40 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
Reel Dimensions (unit: mm)
7REEL1782.03.0130.5210.521 or Bigger1010.512max
13REEL3302.03.0130.5210.521 or Bigger1010.512max
Taping Specification
Top tape peeling strength0.1N < peeling strength < 0.7NNo paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity
SizePaper T/R (Pcs)Plastic T/R (Pcs)
06034000-
080540003000 (T1.35mm)
1206-3000 (T1.60mm)
1210-2000 (T1.85mm)
1808-1000
1812-800 (T1.85mm)
1812-500
Precautions For Use
MLCC may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Follow precautions for safety and application notes. Contact engineering for handling questions.
1. Soldering ProfileFollow the temperature profile in the adjacent graph to avoid cracks due to sudden temperature change.
2. Manual SolderingRisk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact.
3. Optimum Solder Amount for Reflow SolderingRecommended
4. Recommended Soldering MethodSee table below. RReflow Soldering, WWave Soldering.
5. Soldering Temperature ProfileKeep temperature difference between soldering temperature and surface temperature of chips as T150 during preheating.

2509251626_AIDE-CAPACITOR-0805X7R101K500NT_C48579588.pdf

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Coupling and wave filtering capacitor AIDE CAPACITOR 0805X7R101K500NT multi layer ceramic for switch power circuits

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