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| Categories | Bonding Wire |
|---|---|
| Brand Name: | WINNER |
| Model Number: | MW001 |
| Certification: | ISO9100 |
| Place of Origin: | CHINA |
| MOQ: | 1PC |
| Price: | 999 |
| Payment Terms: | L/C,Western Union,T/T |
| Supply Ability: | 100000 rolls per month |
| Delivery Time: | 5-8 WORKING DAYS |
| Packaging Details: | Roll, Neutrial Packing or with OEM LOGO |
| Application: | Semiconductor Packaging, Microelectronics, Medical Devices |
| Package: | Spool |
| Corrosion Resistance: | High |
| Material: | Gold |
| Length Meters: | 500/1000 |
| Product Type: | Bonding Wire |
| Coating: | Gold |
| Bonding Method: | Ultrasonic |
| Temperature Range: | -40°C to 200°C |
| Surface Finish: | Bright |
| Conductivity: | 98% |
| Company Info. |
| SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD. |
| Verified Supplier |
| View Contact Details |
| Product List |
|
Fine 9999% Au gold wire/thread on a spool
Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs
99.99% Pure Gold Bonding Wire 0.015mm 0.018mm 0.02mm 0.025mm 0.03mm
Ultra Fine Gold Bonding Wire, Dia. 13-70μm, 99.99% Purity
24K Gold Bonding Wire 1mm Diameter for Microelectronics with 4N 99.99% Purity
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
20um Gold Bonding Wire for High Electrical Performance and Low Loop in Semiconductor Packaging
9999 Pure 0.03mm Round Gold Bonding Wire for Semiconductor Packaging Microelectronics and Medical Devices
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications
