Sign In | Join Free | My infospaceinc.com
infospaceinc.com
Products
Search by Category
Home > Electronic Signs >

Double-Sided RO3010 PCB 50mil Substrate with Black Silkscreen

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
PCB material: RO3010
Layer count: 2-layer
PCN thickness: 1.3mm
PCB size: 89.65mm x 94.3mm (per piece)
Copper weight: 1oz (1.4 mils) outer layers
Surface finish: EPIG (nickel free)
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

Double-Sided RO3010 PCB 50mil Substrate with Black Silkscreen

This PCB is a double-sided rigid circuit board made of Rogers RO3010 ceramic-filled PTFE composite material, a high-performance base material known for its excellent dielectric stability and mechanical reliability. This PCB features a board thickness of 1.3mm, 1 oz copper weight on outer layers, and EPIG (nickel free) surface finish, ensuring reliable performance and compatibility for various professional electronic applications that require precision and stability.


PCB Details

ItemSpecification
Base materialRO3010
Layer countDouble sided
Board dimensions89.65mm x 94.3mm (per piece)
Minimum Trace/Space5/6 mils
Minimum Hole Size0.25mm
Blind viasNone
Finished board thickness1.3mm
Finished Cu weight (outer layers)1 oz (1.4 mils)
Via plating thickness20 μm
Surface finishEPIG (nickel free)
Top SilkscreenBlack
Bottom SilkscreenNone
Top Solder MaskNone
Bottom Solder MaskNone
Electrical test100% electrical test conducted prior to shipment

PCB Stack-up

This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):

Layer TypeSpecification
Copper_layer_135 μm
Rogers RO3010 Substrate50mil (1.27mm)
Copper_layer_235 μm


Artwork and Quality Standard

The artwork supplied for this PCB follows the Gerber RS-274-X format, which is the industry-standard file format for PCB manufacturing. Additionally, the PCB adheres to the IPC-Class-2 standard, a widely recognized quality standard that specifies acceptable performance and reliability requirements for electronic components, ensuring the PCB meets the necessary criteria for commercial and industrial applications.


Availability

This PCB is offered for global availability, encompassing all major regions and markets worldwide. Its worldwide accessibility ensures that customers across various countries and industries can obtain the product with consistent reliability and timely delivery, catering to both small-batch prototyping requirements and large-volume production orders.


Introduction to RO3010

Rogers RO3010 high-performance circuit materials are PTFE composites filled with ceramics, featuring a higher dielectric constant while maintaining outstanding stability. These competitively priced products deliver excellent mechanical and electrical reliability. Their inherent stability streamlines the design of broadband components and enables the materials to perform effectively across an extensive frequency range and a wide variety of applications. These characteristics make RO3010 laminates an ideal choice for circuit miniaturization.


Benefits of RO3010 Substrate

The RO3010 substrate demonstrates excellent dimensional stability, with a coefficient of thermal expansion (CTE) precisely matched to copper, ensuring minimal thermal warpage and long-term structural integrity.


The laminate features cost-effective pricing, making it well-suited for high-volume manufacturing processes without compromising performance or quality.


The RO3010 material is manufactured in compliance with ISO 9001 quality management system standards, ensuring consistent product quality and traceability.


The substrate is fully compatible with multi-layer printed circuit board (PCB) designs, providing enhanced flexibility for complex circuit integration.


Typical Applications

  • Automotive radar applications
  • Global positioning satellite antennas
  • Cellular telecommunications systems - power amplifiers and antennas
  • Patch antenna for wireless communications
  • Direct broadcast satellites
  • Datalink on cable systems
  • Remote meter readers
  • Power backplanes

RO3010 High Frequency Laminates

RO3010 high frequency circuit materials are ceramic-filled PTFE composites designed specifically for commercial microwave and RF applications. This product series combines outstanding electrical and mechanical stability with competitive pricing. RO3000 series laminates are PTFE-based circuit materials filled with ceramics. Their mechanical properties remain consistent regardless of the chosen dielectric constant, enabling designers to develop multilayer boards that incorporate different dielectric constant materials on individual layers—without risk of warpage or reliability issues.


RO3010 laminates can be processed into printed circuit boards using standard PTFE circuit board fabrication techniques.



PropertyRO3010DirectionUnitsConditionTest Method
Dielectric Constant,εProcess10.2±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign11.2Z8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0022Z10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-395Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
Dimensional Stability0.35
0.31
X
Y
mm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity105MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity105COND AIPC 2.5.17.1
Tensile Modulus1902
1934
X
Y
MPa23℃ASTM D 638
Moisture Absorption0.05%D48/50IPC-TM-650 2.6.2.1
Specific Heat0.8j/g/kCalculated
Thermal Conductivity0.95W/M/K50℃ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
13
11
16
X
Y
Z
ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
Td500℃ TGAASTM D 3850
Density2.8gm/cm323℃ASTM D 792
Copper Peel Stength9.4Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0UL 94
Lead-free Process CompatibleYes

Standard ThicknessesStandard Panel SizesStandard Cladding

RO3010:

0.005” (0.13mm) +/- 0.0005”

0.010” (0.25mm) +/- 0.0007”

0.025” (0.64mm) +/- 0.0010”

0.050” (1.28mm) +/- 0.0020”


RO3010


12”X 18”(305 X 457mm)

24”X 18”(610 X 457mm)

24”X 21”(610 X 533mm)

RO3010

Electrodeposited Copper Foil ½ oz. (18μm)

1 oz. (35μm)

Buy Double-Sided RO3010 PCB 50mil Substrate with Black Silkscreen at wholesale prices
Send your message to this supplier
 
*From:
*To: Bicheng Electronics Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0