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Double-Sided RO3010 PCB on 10mil Laminate with Immersion Gold

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-470.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: RO3010, 0.254mm thickness
Layer count: 2 layers
PCB thickness: 10mil
PCB size: 65mm × 57mm (1PCS)
Solder mask: No
Silkscreen: Black
Copper weight: 1oz (1.4 mils) for outer layers
Surface finish: Immersion Gold
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Double-Sided RO3010 PCB on 10mil Laminate with Immersion Gold

This double-sided PCB is specifically tailored for high-frequency microwave and RF applications, with RO3010 serving as its core substrate material. As a ceramic-filled PTFE composite, RO3010 inherently ensures superior electrical stability, low signal loss, and reliable operational performance, which are critical for meeting the stringent requirements of high-frequency signal transmission and processing in related electronic systems.


PCB Details

Specification ItemDetails
Board TypeDouble-sided PCB
Substrate MaterialRO3010, 0.254mm thickness
Copper Thickness1oz finished copper
Surface TreatmentNo solder mask, black silkscreen; Immersion gold finish
Dimension65mm × 57mm (1PCS)


RO3010 Introduction

RO3010 is a member of the RO3000® series high-frequency circuit materials, which are ceramic-filled PTFE (Polytetrafluoroethylene) composites specifically developed for commercial microwave and RF (Radio Frequency) applications. The RO3000 series is designed to provide exceptional electrical and mechanical stability at competitive prices, making it a cost-effective choice for high-frequency circuit design.


As a ceramic-filled PTFE-based circuit material, RO3010 has consistent mechanical properties regardless of the dielectric constant selected. This unique characteristic allows designers to develop multilayer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability issues during processing and application.


RO3010 exhibits excellent dimensional stability, with a coefficient of thermal expansion (CTE) in the X and Y axes that matches that of copper, ensuring minimal dimensional changes even under temperature fluctuations. Additionally, it features outstanding plated through-hole reliability, even in severe thermal environments, thanks to its stable Z-axis CTE. The material can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques, with only minor modifications required as described in the application note “Fabrication Guidelines for RO3000 Series High Frequency Circuit Materials.”


RO3010 Typical Values

PropertyRO3010 Typical ValueDirectionUnitsConditionTest Method
Dielectric Constant, εProcess10.2±0.05Z-10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, εDesign11.2Z-8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor, tanδ0.0022Z-10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-395Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
Dimensional Stability0.35; 0.31X; Ymm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity10⁵-MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity10⁵-COND AIPC 2.5.17.1
Tensile Modulus1902; 1934X; YMPa23℃ASTM D 638
Moisture Absorption0.05-%D48/50IPC-TM-650 2.6.2.1
Specific Heat0.8-j/g/k-Calculated
Thermal Conductivity0.95-W/M/K50℃ASTM D 5470
Coefficient of Thermal Expansion (-55 to 288℃)13; 11; 16X; Y; Zppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
Td500-℃ TGA-ASTM D 3850
Density2.8-gm/cm³23℃ASTM D 792
Copper Peel Strength9.4-Ib/in.1oz, EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0---UL 94
Lead-free Process CompatibleYes----

RO3010 Application Fields

Benefiting from its excellent electrical performance, mechanical stability, and cost-effectiveness, RO3010 is widely used in commercial microwave and RF applications, where high signal integrity and dimensional stability are critical. Its main application fields include:


-Microwave Communication Equipment: Used in microwave transceivers, power amplifiers, and microwave filters, where its low dissipation factor and stable dielectric constant ensure minimal signal loss and reliable performance.


-RF Communication Systems: Applied in RF antennas, radar systems, and satellite communication equipment, leveraging its excellent dimensional stability and thermal performance to adapt to complex environmental conditions.


-High-Frequency Test Equipment: Used in test probes, signal generators, and spectrum analyzers, where precise electrical parameters are required to ensure accurate test results.


-Consumer Electronics: Integrated into high-frequency modules of advanced consumer electronics, such as 5G communication devices, to support high-speed signal transmission.


-Industrial and Medical Electronics: Used in industrial control systems and medical diagnostic equipment that require high-frequency signal processing, thanks to its reliable performance and lead-free compatibility.


In summary, RO3010 is a high-performance, cost-effective high-frequency circuit material that meets the requirements of various commercial microwave and RF applications, providing designers with a flexible and reliable solution for circuit design.


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