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TLX-8 PCB Immersion Gold 2-layer 30mil Laminate RF Circuit Board

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-470.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Taconic TLX-8
Layer count: 2 layers
PCB thickness: 30mil
PCB size: 40.5mm x 70.6mm per unit
Solder mask: No
Silkscreen: No
Copper weight: 1 oz (equivalent to 1.4 mils) for outer layers
Surface finish: Immersion Gold
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TLX-8 PCB Immersion Gold 2-layer 30mil Laminate RF Circuit Board

This is a high-performance 2-layer rigid printed circuit board (PCB) fabricated with TLX-8 high-frequency laminate, featuring a 30mil (0.762mm) board thickness, 1oz copper weight, immersion gold surface finish, and no solder mask or silkscreen (no oil, no text). This PCB leverages TLX-8’s superior electrical and mechanical properties, making it suitable for various high-frequency applications that demand stable performance and reliable structural integrity.


PCB Specification

ItemSpecifications
Base MaterialTLX-8 High-Frequency Laminate
Layer Count2 layers (double-sided PCB)
Board Dimensions40.5mm x 70.6mm per unit, 1 piece total
Finished Board Thickness30mil (0.762mm)
Finished Copper Weight1 oz
Surface FinishImmersion Gold
Top/Bottom Solder MaskNot applied (no oil)
Top/Bottom SilkscreenNot applied (no text)

PCB Stack-up

LayerDescriptionThickness
1Copper Layer 1 (Outer Top)35 μm (1 oz)
-TLX-8 Substrate30mil (0.762mm)
2Copper Layer 2 (Outer Bottom)35 μm (1 oz)


Introduction to TLX-8 Material

TLX-8 is a high-performance high-frequency laminate engineered for demanding RF, microwave, and high-speed digital applications. It exhibits excellent dielectric properties, low dissipation factor, and superior mechanical stability, making it ideal for applications that require minimal signal loss, reliable thermal performance, and consistent dimensional stability. The material is compatible with standard PCB fabrication processes, ensuring ease of manufacturing while maintaining high performance standards.


TLX-8 Material Properties

PropertiesConditionsTypical ValueUnitTest Method
Dielectric Constant@ 10 GHz2.55 ± 0.04-IPC-650 2.5.5.3
Dissipation Factor@ 10 GHz0.0018-IPC-650 2.5.5.5.1
Outgassing - % TML4 H 257 °F @ ≤ 5 x 10⁻⁵ Torr0.03%ASTM E 595
Outgassing - % CVCM4 H 257 °F @ ≤ 5 x 10⁻⁵ Torr0.00%ASTM E 595
Outgassing - % WVR4 H 257 °F @ ≤ 5 x 10⁻⁵ Torr0.01%ASTM E 595
Surface Resistivity (Elevated Temp.)-6.605 x 10⁸MohmIPC-650 2.5.17.1 Sec. 5.2.1
Surface Resistivity (Humidity Cond.)-3.550 x 10⁶MohmIPC-650 2.5.17.1 Sec. 5.2.1
Volume Resistivity (Elevated Temp.)-1.110 x 10¹⁰Mohm/cmIPC-650 2.5.17.1 Sec. 5.2.1
Volume Resistivity (Humidity Cond.)-1.046 x 10¹⁰Mohm/cmIPC-650 2.5.17.1 Sec. 5.2.1
Dimensional Stability (MD, After Bake)-0.06mm/M (mils/in)IPC-650 2.4.39 Sec. 5.4
Dimensional Stability (CD, After Bake)-0.08mm/M (mils/in)IPC-650 2.4.39 Sec. 5.4
Dimensional Stability (MD, Thermal Stress)-0.09mm/M (mils/in)IPC-650 2.4.39 Sec. 5.5
Dimensional Stability (CD, Thermal Stress)-0.10mm/M (mils/in)IPC-650 2.4.39 Sec. 5.5
Thermal Conductivity-0.19W/M*KASTM F433/ASTM 1530-06
CTE (25-260 °C) - X-21ppm/°CIPC-650 2.4.41/ASTM D 3386
CTE (25-260 °C) - Y-23ppm/°CIPC-650 2.4.41/ASTM D 3386
CTE (25-260 °C) - Z-215ppm/°CIPC-650 2.4.41/ASTM D 3386
Td (2% Weight Loss)-535°CIPC-650 2.4.24.6 (TGA)
Td (5% Weight Loss)-553°CIPC-650 2.4.24.6 (TGA)
Peel Strength (1 oz. ED, Thermal Stress)-2.63 (15)N/mm (Ibs/in)IPC-650 2.4.8 Sec. 5.2.2
Peel Strength (1 oz. RTF)-2.98 (17)N/mm² (kpsi)-
Peel Strength (½ oz. ED, Elevated Temp.)-2.45 (14)N/mm² (kpsi)IPC-650 2.4.8.3
Peel Strength (½ oz. ED, Thermal Stress)-1.93 (11)N/mm² (kpsi)IPC-650 2.4.8 Sec. 5.2.2
Peel Strength (1 oz. rolled)-2.28 (13)N/mm² (kpsi)-
Young’s Modulus (MD, ASTM D 902)-6,757 (980)N/mm² (psi)ASTM D 902
Young’s Modulus (CD, ASTM D 902)-8,274 (1,200)N/mm² (psi)ASTM D 902
Young’s Modulus (MD, ASTM D 3039)-11,238 (1,630)N/mm² (psi)ASTM D 3039
Moisture Absorption-0.02%IPC-650 2.6.2.1
Dielectric Breakdown-> 45KvIPC-650 2.5.6
Flammability Rating-V-0-UL-94

Typical Applications of TLX-8 PCB

-RF and microwave communication equipment

-High-speed digital circuits

-Test and measurement instruments

-Aerospace and defense electronic systems

-Satellite communication components

-Radar and navigation systems

-Wireless communication devices


Artwork, Quality Standard and Availability

Artwork for this PCB is provided in the Gerber RS-274-X format, the industry standard for PCB manufacturing, ensuring seamless compatibility with mainstream production equipment and design software. The PCB complies with recognized industry standards, guaranteeing consistent electrical performance, reliable manufacturing quality, and adherence to requirements for high-frequency applications. Furthermore, this PCB is available worldwide, catering to the needs of international customers and high-frequency circuit projects globally.


Conclusion

Due to its excellent dielectric properties, minimal signal loss , superior thermal stability and mechanical reliability. This TLX-8 PCB has become the optimal choice for professionals and project teams engaged in RF communication, microwave systems, high-speed digital circuits, aerospace and defense electronics, satellite communication, radar, navigation, and wireless communication sectors that demand high-performance and stable high-frequency circuit solutions.


Buy TLX-8 PCB Immersion Gold 2-layer 30mil Laminate RF Circuit Board at wholesale prices
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