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| Categories | Flexible PCB Board |
|---|---|
| Brand Name: | Xing Qiang |
| Model Number: | As Per Customer's Model |
| Place Of Origin: | China |
| Certification: | ISO 9001 / ROHS /UL / IATF 16949 (automotive) |
| MOQ: | Sample,1 Pc(5 Square Meters) |
| Price: | Based on Gerber Files |
| Packaging Details: | Carton Or As Per Customer's Request |
| Delivery Time: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 100000㎡/Month |
| Product Name: | Customized Flexible PCB |
| Place Of Orignial: | China |
| Base Material: | Polymide |
| Minimum Line Width: | 0.075mm |
| Layercount: | 1 To 30 Layers |
| Heat Resisitant: | - 65℃~+150℃ |
| Solder Mask: | Black or Tailored |
| Testing Standard: | IPC-A-610 E Class II |
| PCB Size: | According To Customer Request |
| Company Info. |
| Dongguan Xingqiang Circuit Board Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
| Product Name | Custom PCB Board |
| Base Material | Polymide |
| PCB Size | As per your request |
| Copper Overall | 05-5oz |
| PTH | 0.075Mm |
| Minimum Line Spacing | 3Mil(0.075mm) |
| Min.hole Size | 0.1Mm |
| Silkscreen Color | White,Red,Black,Yellow |
| Solder Mask Ink Color | Black/Yellow/Red/White/Blue/Green |
| Size or Dimension | According To Customer Request |
| Aspect | Custom PCBs | Off-the-Shelf PCBs |
|---|---|---|
| Design Flexibility | Fully customizable size, shape, layer count, and routing to match product requirements | Fixed dimensions, layouts, and features; limited to standard configurations |
| Performance & Features | Support HDI, microvias, controlled impedance, and specialized materials/finishes (ENIG, HASL, OSP) | Basic circuitry only; no advanced features, poor impedance control, limited material options |
| Space & Integration | Optimized for miniaturization, fits compact/irregular form factors (wearables, medical devices) | One-size-fits-all; bulky, wastes space, hard to integrate into slim designs |
| Reliability | Tailored for harsh environments, with rigorous testing (flex fatigue, thermal cycling) | Generic build; lower durability, higher failure risk in demanding applications |
| Cost Efficiency | Higher upfront tooling, but lower long-term costs via optimized assembly and mass production | Lower upfront cost, but higher assembly costs, compatibility issues, and redesign expenses |

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