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Customized Flexible Printed Circuit Board for with Immersion Gold & OSP Surface Finish

Categories Flexible PCB Board
Brand Name: Xing Qiang
Model Number: As Per Customer's Model
Place Of Origin: China
Certification: ISO 9001 / ROHS /UL / IATF 16949 (automotive)
MOQ: Sample,1 Pc(5 Square Meters)
Price: Based on Gerber Files
Packaging Details: Carton Or As Per Customer's Request
Delivery Time: NA
Payment Terms: ,T/T,Western Union
Supply Ability: 100000㎡/Month
Product Name: Customized Flexible PCB
Place Of Orignial: China
Base Material: Polymide
Minimum Line Width: 0.075mm
Layercount: 1 To 30 Layers
Heat Resisitant: - 65℃~+150℃
Solder Mask: Black or Tailored
Testing Standard: IPC-A-610 E Class II
PCB Size: According To Customer Request
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Customized Flexible Printed Circuit Board for with Immersion Gold & OSP Surface Finish

Custom FPC Fabrication for Wearable & Medical Applications:

We specialize in custom flexible printed circuit (FPC) fabrication.We support surface finishes such as ENIG, HASL and OSP, and integrate advanced features like blind microvias, controlled impedance routing, and coverlay protection. Our panelized manufacturing ensures cost efficiency, while rigorous reliability testing (including flexural fatigue and thermal cycling) guarantees performance in dynamic applications like wearables and medical devices.

Technical Parameters:

Product NameCustom PCB Board
Base MaterialPolymide
PCB SizeAs per your request
Copper Overall05-5oz
PTH0.075Mm
Minimum Line Spacing3Mil(0.075mm)
Min.hole Size0.1Mm
Silkscreen ColorWhite,Red,Black,Yellow
Solder Mask Ink ColorBlack/Yellow/Red/White/Blue/Green
Size or DimensionAccording To Customer Request

Custom PCBs vs. Off-the-Shelf PCBs::

AspectCustom PCBsOff-the-Shelf PCBs
Design FlexibilityFully customizable size, shape, layer count, and routing to match product requirementsFixed dimensions, layouts, and features; limited to standard configurations
Performance & FeaturesSupport HDI, microvias, controlled impedance, and specialized materials/finishes (ENIG, HASL, OSP)Basic circuitry only; no advanced features, poor impedance control, limited material options
Space & IntegrationOptimized for miniaturization, fits compact/irregular form factors (wearables, medical devices)One-size-fits-all; bulky, wastes space, hard to integrate into slim designs
ReliabilityTailored for harsh environments, with rigorous testing (flex fatigue, thermal cycling)Generic build; lower durability, higher failure risk in demanding applications
Cost EfficiencyHigher upfront tooling, but lower long-term costs via optimized assembly and mass productionLower upfront cost, but higher assembly costs, compatibility issues, and redesign expenses


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