Sign In | Join Free | My infospaceinc.com
infospaceinc.com
Products
Search by Category
Home > Used Measuring & Analysing Instruments >

SiC Coating Machine – Precise Adhesive Deposition for Wafers & Graphite Materials

Categories Semiconductor Equipment
Brand Name: ZMSH
Place of Origin: SHANGHAI,CHINA
MOQ: 1
Payment Terms: T/T
Delivery Time: 2-4 WEEKS
Machine Dimensions: 920 × 1060 × 1620 mm
Effective Coating Area: 500 × 500 mm
Power Supply: 120V / 220V ±10%, 50–60Hz
Nozzle Type: Ultrasonic, multiple options available
Coating Thickness: 20 nm – tens of µm
Liquid Flow Rate: 0.006 – 3 ml/s
Positioning: Laser alignment
Motion Control: XYZ coordinated axes, independently programmable
Liquid Delivery: Constant-flow with online dispersion
Waste Management: Auto-cleaning nozzle, waste liquid recycling, exhaust system
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

SiC Coating Machine – Precise Adhesive Deposition for Wafers & Graphite Materials

SiC Coating Machine – Precise Adhesive Deposition for Wafers & Graphite Materials


Product Overview


The SiC Coating Machine is a fully automated, programmable standalone system designed for precise adhesive deposition between wafers, SiC seeds, graphite paper, and graphite plates.

It ensures controlled and uniform coating thickness, preventing local buildup or thin spots, and provides a stable foundation for subsequent vacuum degassing and high-temperature sintering.

Ideal for pilot-scale or medium-to-large batch production, the system supports high repeatability and consistent coating quality.



Key Features


  • Precise Coating: Controlled adhesive thickness ensures uniform deposition between wafers, graphite paper, and graphite plates.

  • Broad Compatibility: Works with adhesives containing solid particles, supporting a wide range of formulations.

  • Automated Operation: Programmable standalone control with coordinated XYZ motion; suitable for batch or pilot-scale production.

  • Stable Pre-Treatment: Provides a reliable foundation for subsequent vacuum degassing and high-temperature sintering.

  • High Repeatability: Ensures consistent coating across all batches, improving yield and process stability.


Specifications


ParameterSpecificationNotes
Machine Dimensions920 × 1060 × 1620 mmStandard model, customizable
Effective Coating Area500 × 500 mmExpandable
Power Supply120V / 220V ±10%, 50–60HzRegion-dependent
Nozzle TypeUltrasonic, multiple options availableCompatible with various coating thickness requirements
Coating Thickness20 nm – tens of µmPrecisely controlled, avoids local buildup or thin coating
Liquid Flow Rate0.006 – 3 ml/sDepends on solvent and nozzle type
PositioningLaser alignmentAccurate nozzle positioning
Motion ControlXYZ coordinated axes, independently programmableSupports batch or pilot-scale production
Liquid DeliveryConstant-flow with online dispersionHandles solid-containing adhesives, prevents sedimentation
Waste ManagementAuto-cleaning nozzle, waste liquid recycling, exhaust systemReduces maintenance cost
HeatingMicron-scale vacuum adsorption heating plate, multi-zone controlSuitable for flexible substrates such as battery separators
High-Temperature OptionUp to 750°C hot plateEnables spray pyrolysis thin-film preparation


Typical Applications


  • Semiconductors & SiC Crystal Growth: Seed bonding, wafer preparation

  • Conductive & Functional Coatings: SiC, flux, photoresist coatings

  • Flexible Substrates & Battery Separators: Handles solid-containing adhesive solutions

  • Glass & Photovoltaic Materials: Uniform coating between graphite plates and paper


FAQ – Frequently Asked Questions


Q1: Can the machine handle adhesives containing solids?
A1: Yes. The machine uses high-precision constant-flow delivery with online dispersion, ensuring uniform spraying of solid-containing adhesives without nozzle clogging.


Q2: How precise is the coating thickness control?
A2: Coating thickness ranges from 20 nm to tens of microns, with precise control for uniformity and repeatability.


Q3: What types of substrates are supported?
A3: Wafers, SiC seeds, graphite paper, and graphite plates, including flexible substrates with vacuum-assisted heating.


Q4: Can the machine be used for batch production?
A4: Yes. The XYZ-axis programmable control supports pilot-scale to medium-large batch production, with multi-nozzle parallel operation.


Q5: How is coating uniformity ensured?
A5: Laser alignment, constant-flow delivery, multi-nozzle synchronization, and ultrasonic nozzle technology ensure >95% uniformity.


Q6: Is machine maintenance complicated?
A6: No. The machine is equipped with auto-cleaning nozzles, waste liquid recycling, and exhaust systems, minimizing maintenance requirements.



Buy SiC Coating Machine – Precise Adhesive Deposition for Wafers & Graphite Materials at wholesale prices
Send your message to this supplier
 
*From:
*To: SHANGHAI FAMOUS TRADE CO.,LTD
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0