F4BTMS430 PCB 2-layer 10mil Thick with ENIG Finish

This PCB adopts F4BTMS430 as its base material, features an Immersion Gold (ENIG) surface finish, and strictly complies with IPC-Class-2 quality standards. It is configured as a 2-layer rigid structure with a 0.254mm (10 mil) F4BTMS430 substrate core, specifically engineered to meet the high-reliability requirements of aerospace, military, and phase-sensitive electronic systems.

PCB Specifications

Stack-up Configuration

F4BTMS430 Material Introduction

The F4BTMS series represents an upgraded iteration of the F4BTM series, achieving technological breakthroughs in material formulation and manufacturing processes. By incorporating a high volume of ceramics and reinforcing with ultra-thin, ultra-fine glass fiber cloth, it delivers significantly enhanced performance and a wider range of dielectric constants. As a high-reliability material tailored for aerospace applications, it serves as a viable alternative to similar foreign products.

F4BTMS430 integrates a small quantity of ultra-thin ultra-fine glass fiber cloth, a high concentration of uniformly dispersed special nano-ceramics, and PTFE resin. This unique formulation minimizes the adverse effects of glass fiber on electromagnetic wave propagation, reducing dielectric loss, enhancing dimensional stability, and lowering X/Y/Z anisotropy. It also extends the usable frequency range, improves electrical strength, boosts thermal conductivity, and demonstrates excellent low thermal expansion coefficient and stable dielectric temperature characteristics. Standardly paired with RTF low-roughness copper foil, it reduces conductor loss and ensures superior peel strength, compatible with both copper and aluminum substrates.

F4BTMS430 Material Features

F4BTMS430 Material Benefits

-Superior Electrical Performance: Matched with RTF low-roughness copper foil to reduce conductor loss, minimize electromagnetic wave interference, and ensure excellent peel strength.

-Enhanced Dimensional Stability: The combination of ultra-thin ultra-fine glass fiber cloth and nano-ceramic formulation lowers anisotropy, optimizing signal propagation and structural reliability.

-Broad Environmental Adaptability: Integrates low moisture absorption, stable dielectric temperature characteristics, and a wide operating temperature range (-55°C to 288°C) to suit harsh environments.

-High Aerospace Reliability: Serves as a substitute for foreign equivalents, offering enhanced thermal conductivity, electrical strength, and consistent performance for critical applications.

Typical Applications

-Aerospace & Cabin Equipment

-Microwave/RF Systems

-Radar & Military Radar Equipment

-Feed Networks

-Phase-Sensitive & Phased Array Antennas

-Satellite Communication Systems

Quality & Availability

This PCB strictly adheres to IPC-Class-2 quality standards, thereby ensuring reliable performance for aerospace, military, and commercial electronic systems. It is available for worldwide, providing robust support for global projects and facilitating timely international delivery.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, high-frequency passive components, microstrip and stripline circuits, millimeter-wave equipment, radar systems, and digital RF antennas. The company’s high-frequency PCBs are primarily manufactured using three major high-frequency material brands: Rogers Corporation, Taconic, and Wangling, with dielectric constants ranging from 2.2 to 10.2. Headquartered in the economically vibrant city of Shenzhen, Bicheng PCB operates with a philosophy rooted in serving small and medium-sized enterprises, offering a wide variety of circuit boards to meet diverse market demands.

Main Business & PCB Applications

The company upholds the highest manufacturing standards to deliver products known for exceptional quality, performance, and reliability. In addition to high-frequency PCBs, Bicheng has divisions specializing in FR-4 circuit boards, flexible circuits, and metal-core PCBs, supporting everything from prototyping and small runs to mass production. The company actively develops value-added PCB solutions such as HDI, quick-turn production, impedance control, heavy copper, and backplane boards. This strategic focus enables Bicheng to offer an extended and complementary product range, forming an integrated line that spans from low-end to high-end PCBs. These circuit boards are widely used in home appliances, portable and consumer electronics, medical devices, aerospace, and telecommunications.

Main Material Partners