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Scienscope X-RAY 3D AXI 8000 Fully Automatic HIGH END

Categories SMT Line Machine
Brand Name: Scienscope
Model Number: X-RAY 3D AXI 8000 Fully Automatic
MOQ: 1 set of machine or mixed order is also acceptable
Price: Negotiable
Payment Terms: L/C, D/A, D/P, T/T, Western Union,MoneyGram
Delivery Time: 5-8 Working days
Packaging Details: Standard export boxes and sturdy hardwood packages are both options
Certification: CE
Place of Origin: CHINA
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Scienscope X-RAY 3D AXI 8000 Fully Automatic HIGH END

Scienscope X-RAY 3D AXI 8000 Fully Automatic


The Scienscope X-RAY 3D AXI 8000 Fully Automatic is an entirely automated 3D X-ray inspection system that utilizes sophisticated CT (Computed Tomography) technology. Think of it as a highly advanced scanner, providing a complete 360-degree view within your electronic components without requiring disassembly.


How does it work?


The Scienscope X-RAY 3D AXI 8000 Fully Automatic has an innovative system that captures projection mappings by rotating around the object in a full circle. Subsequently, it employs edge-scan and 3D analysis techniques to reconstruct all collected data. It's akin to creating a digital 3D replica that allows you to examine the internal structure from any perspective to identify even the tiniest defects.


What is 3D AXI?


3D Automated X-ray Inspection (AXI) represents a cutting-edge approach in electronics manufacturing, designed to deliver comprehensive evaluations of Printed Circuit Boards (PCBs). Unlike conventional 2D X-ray methods, 3D AXI leverages computed tomography (CT) to produce detailed, three-dimensional visualizations of the internal composition of electronic components and solder connections. This sophisticated technique allows for the identification of defects that are undetectable via 2D X-ray, including voids, misalignments, and inadequate solder application.



Scienscope X-RAY 3D AXI 8000 Fully Automatic Operational Mechanics


3D AXI systems function by capturing projection mappings through a complete 360-degree rotation around the subject object. Subsequently, edge-scan and 3D analytical techniques are employed to reconstruct the collected data, generating a virtual 3D model. This model can be examined from any angle to pinpoint even the most minute anomalies.


Technical Parameter


X illuminant

Light tube voltage, current130KV 300uA
maximum output39W
FPDresolution ratio50um
frame rate1x1 9fps, 2x2 18fps
Pixel size2340x2882
CCD camerapixel2.3 megapixel
functionScan the barcode
CT parametersresolution ratio5um
Number of projections32,64,120
Shooting Angle60°, 90°
Maximum number of layersUnlimited (recommended <300)

Test Parameters

Feed height85mm on top, 20mm on bottom
Delivery directionLeft in, right out
PCB size100x50-400x400
Circuit board thickness≥0.5mm

Height of test object

components

85mm on top, 20mm on bottom
Object weight≤5KG
fov big or small58x70mm (25μm precision), 11x14mm (5μm precision)
Plate bending correctionHardware correction
safetyradiation1μSv/H
safety interlockinghave

Environmental requirements

working temperature0-40℃
Working humidity40%-60%
working power supply220V
aggregate capacity2KW
Pressure requirements0.4-0.6 MPa
Load capacity requirements1.5T/㎡
Device appearancesize1625mm*1465mm*1905mm
weight2.5T

Scienscope X-RAY 3D AXI 8000 Fully Automatic Key Advantages


  • Extensive Flaw Detection : Capable of identifying a broad spectrum of defects, such as issues in solder joint integrity, component displacement, air pockets, and concealed electrical short circuits.
  • High-Resolution Imaging : Employs advanced X-ray cameras and sophisticated algorithms to secure detailed imagery, providing critical insights into the internal architecture and robustness of PCBs.
  • Streamlined Efficiency and Usability : Equipped with intuitive interfaces and user-friendly software, facilitating straightforward operation and rapid inspection cycles to boost production throughput.
  • Automated Calibration : Select systems feature the ability to automatically adjust inspection parameters to accommodate shifts in production items, thereby minimizing initial setup losses and the necessity for manual recalibrations.

Scienscope X-RAY AXI 8000 Essential Attributes & Specifications


  • Complete 3D X-Ray Analysis : Offers full 3D reconstruction for thorough assessment.
  • Non-Invasive Assessment : Allows for the inspection of circuit boards without inducing damage.
  • Adaptable Layer Selection : Permits the selection of the necessary number of layers for examination.
  • Customizable Resolution : Enables the adjustment of resolution based on the dimensions of components and solder balls, ensuring precision.
  • Accelerated Edge Scanning : Incorporates rapid scanning and reconstruction technologies.
  • Broad Ray Cone Angle : Delivers superior longitudinal resolution for enhanced inspection.

Scienscope X-RAY AXI 8000 Common Applications are:


  • Inspection of Surface Mount Technology (SMT) and Through-Hole Components : Guarantees the quality of solder joints and the precision of component placement in both SMT and through-hole assemblies.
  • Examination of Ball Grid Arrays (BGAs) and Press-Fit Connectors : Detects faults in BGA solder joints and verifies the integrity of press-fit connections.
  • Dual-Sided PCB Analysis : Evaluates both faces of a double-sided PCB to ensure uniform quality standards.

Cutting-Edge Technologies


  • Computed Tomography (CT) : Utilizes X-rays to create sectional images of an object, which are then compiled to form a 3D representation.
  • High-Definition X-Ray Cameras : Capture intricate images of the internal structures of electronic parts.
  • Automated Anomaly Recognition (AAR) : Employs software algorithms to automatically identify defects through image analysis.
  • Real-Time Oversight and Management : Empowers operators to supervise the inspection process and implement adjustments as required.

Merits of Adopting 3D AXI


  • Enhanced Quality Assurance : Identifies defects early in the production cycle, preventing the circulation of defective products.
  • Amplified Productivity : Automates the inspection workflow, diminishing the reliance on manual labor and accelerating production speeds.
  • Economical Benefits : Lowers waste and the necessity for rework by spotting defects before they escalate into significant problems.
  • Heightened Dependability : Confirms that electronic goods adhere to the highest benchmarks of quality and reliability.

Conclusion


Scienscope X-RAY AXI 8000 3D AXI systems are indispensable for upholding the quality and dependability of electronic products. By supplying comprehensive three-dimensional imagery of internal structures, these systems enable manufacturers to uncover defects that might otherwise go unnoticed.


For inquiries, please contact us at +8613537875415 or Lizzy@smtlinemachine.com. Visit us at Xintian Industrial Area, Baoan, Shenzhen City, China.


Packaging and Delivery Information:


Delivery: Expect your order to arrive within 5-8 business days, though this timeframe can vary based on the quantity ordered.

Minimum Order: We accept orders for a single machine or mixed orders to suit your needs.

Transportation: Products are shipped either in bulk or via containers, depending on the order size and destination.

Payment Terms: Flexible payment options are available, including L/C, D/A, D/P, T/T, Western Union, and MoneyGram.

Price: Prices are negotiable to ensure you receive the best possible value.

Packaging: We offer both standard export boxes and robust hardwood packages to ensure your order arrives safely and securely.

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