Double-Sided F4BTM300 PCB RF Substrate 10mil ENIG Finish

This PCB utilizes F4BTM300 as its base material, features an Electroless Nickel Immersion Gold (ENIG) surface finish, and strictly conforms to IPC-Class-2 quality standards. It adopts a 2-layer rigid structure, tailored to meet the high-performance demands of aerospace, military, and phase-sensitive electronic systems.

PCB Specifications

Stack-up Configuration

F4BTM300 Material Introduction

F4BTM series laminates are produced through a precision manufacturing process, blending glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin in a scientifically formulated mixture. Built on the F4BM dielectric layer, F4BTM300 incorporates high-Dk, low-loss nano-ceramics, yielding enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, elevated insulation resistance, and improved thermal conductivity—all while maintaining low-loss performance.

F4BTM300 laminates are specifically matched with reverse-treated RTF copper foil, delivering excellent PIM performance, precise line accuracy, and minimized conductor loss. These characteristics make it ideal for demanding applications that require stable performance across extreme temperature ranges and harsh operating environments.

F4BTM300 Material Features

F4BTM300 Material Benefits

-Superior Electrical Performance: Paired with reverse-treated RTF copper foil to deliver excellent PIM performance, precise line control, and minimized conductor loss.

-Enhanced Environmental Adaptability: Combines low moisture absorption, high heat resistance, and stable performance from -55°C to 288°C, suitable for harsh environments.

-Balanced Dielectric & Thermal Traits: Integrates high Dk, low loss, and improved thermal conductivity to support high-power and high-frequency operations.

-Robust Insulation: Offers increased insulation resistance, ensuring reliable isolation in precision electronic assemblies.

Typical Applications

Aerospace & Cabin Equipment

Microwave/RF Systems

Radar & Military Radar Equipment

Feed Networks

Phase-Sensitive & Phased Array Antennas

Satellite Communication Systems

Quality & Availability

This PCB meets IPC-Class-2 quality standards, ensuring reliable performance for commercial, military, and aerospace electronic systems. Artwork is provided in the industry-standard Gerber RS-274-X format, compatible with global manufacturing processes. It is available worldwide, supporting global projects and timely international delivery.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners