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Micro Type COB LED Display Flip Chip Common Cathode Ultra Fine Display

Categories COB LED Display
Bottom Case: Used to secure and protect modules. Common materials are die-cast aluminum or injection-molded plastic. Die-cast aluminum is often used in high-end products due to its high strength and good heat dissipation.
Certification: CE, CCC, FCC, ETC, CB, EMC, RoHs
Application: Home theaters, high-end conference rooms, control rooms, studios, exhibitions, high-end commercial displays, virtual filming, etc.
Model Number: P0.78125
PCB (Printed Circuit Board) Material: This is the core component that carries all the parts. It is typically a high-performance multilayer board of FR-4 grade, offering excellent electrical performance and heat dissipation.
Payment Terms: T/T
Weight: Cabinet Weight: 4.7 kg (per cabinet) Module Weight: 1.2 kg (per module)
control system: NovaStar / Linsn / Colorlight Synchronous Control System (Sending Card + Receiving Card)
Mask: It covers the very front of the module, serving to protect and align the optics. Traditionally, it's made of PC (polycarbonate) and fiber. However, to achieve better display results, many high-end COB products have adopted a maskless design, with the surfa
Price: To be negotiated
Dimensions: 150×168.75mm
Encapsulation materials: This is the core of COB technology. LED chips are directly encapsulated on the PCB, and the surface is typically covered with highly transparent, aging-resistant materials such as epoxy resin or silicone to provide protection and optimize light output. Som
Supply Ability: 10000above
color: White and black colors are customizable
pattern: 1R1G1B SMD
MOQ: 1PCS
Delivery Time: 10-15Days
Function: Employing full flip-chip COB common cathode technology, it achieves pixel-level precise light control, delivering pure blacks and ultra-high contrast for a stunningly immersive visual experience. The surface light source design ensures a uniform and soft i
shape: Standard Rectangle
Place of Origin: China
Feature: Seamless splicing – no visible gaps, creating a truly unified display surface. • Excellent heat dissipation – efficient thermal management for stable performance. • Superior flatness – ensures consistent image quality across the entire screen. • Low temper
Brand Name: No brand
Product name: Micro-type fully flip-chip common cathode COB display panel
Packaging Details: LED modules are packaged in cardboard boxes, rental displays are packaged in flight cases, and regular products are packaged in wooden crates.
service: 2-3 years warranty + free spare parts + lifetime remote support + RMA repair + on-site service available
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Micro Type COB LED Display Flip Chip Common Cathode Ultra Fine Display

Micro-type fully flip-chip common cathode COB display panel

Main features:

  • Flip Chip Technology COB flip chip technology means that the electrodes of the flip chip face downwards, and it does not require the wire bonding process of the upright chip. This makes the active layer closer to the substrate, shortens the heat flow path from the heat source to the substrate, has lower thermal resistance, and can greatly improve product stability.
  • "Common cathode" refers to using a common cathode method to power LED displays. For products of the same specifications and brightness, common cathode LED displays consume approximately 40% less power than conventional LED displays, resulting in reduced energy consumption.
  • Matte Finish
    This product combines a nano-superconducting epoxy resin coating on the screen to ensure consistent ink color over a long period, achieving ultra-high contrast without affecting brightness. The surface uses a matte, non-reflective treatment technology to prevent glare and protect the eyes, bringing a comfortable visual experience.
  • High Protection: Compared to SMD LED screens, COB technology offers a higher level of protection. It provides advantages such as waterproofing, impact resistance, moisture resistance, shock resistance, oxidation resistance, salt spray resistance, anti-static properties, and easy cleaning, significantly reducing issues like dead LEDs and poor contact caused by collisions during transportation, installation, and use.
  • Low failure rate: The COB process encapsulates the light-emitting chip on a PCB board, and the heat of the chip is quickly transferred out through the copper foil on the PCB board. It also eliminates the need for high-temperature processes such as reflow soldering, which greatly reduces the damage to the light-emitting chip. In addition, the yield rate of the COB process is constantly improving, so the failure rate is greatly reduced.
  • The image is softer. COB realizes the conversion from "point" light source to "area" light source, which has better light perception. The area light source emits light without pixelation, making the image softer. It effectively suppresses moiré patterns, resulting in a higher quality display. It is not harmful to the eyes when viewed at close range and is less likely to cause visual fatigue.

Product Advantages:

• Seamless splicing – no visible gaps, creating a truly unified display surface.
• Excellent heat dissipation – efficient thermal management for stable performance.
• Superior flatness – ensures consistent image quality across the entire screen.
• Low temperature rise – keeps the panel cool even during extended operation.
• Long lifespan – built with durable components for years of reliable service.
• Fanless design – eliminates moving parts, reducing maintenance needs.
• Silent operation – zero noise, perfect for quiet environments like home theaters and conference rooms.
• Automatic alarm system – real‑time monitoring with instant fault alerts.
• Low failure rate – high reliability with minimal downtime.
• Safe and secure – designed with multiple protections for worry‑free use


Product Specifications

ParameterP0.78125P0.9375P1.25P1.5625
Pixel Pitch (mm)0.781250.93751.251.5625
Pixel Density (px/m²)1,638,4001,137,778640,000409,600
Cabinet Resolution (px)768 × 432640 × 360480 × 270384 × 216
Refresh Rate (Hz)≤ 3840
Cabinet Size (mm)600 × 337.5 × 28
LED TypeFlip‑chip Common‑Cathode COB Package
White Balance Brightness (CD/m²)200 ~ 1000 (adjustable)
Contrast Ratio≥ 1,000,000 : 1
Gray Scale (Bit)13 ~ 16

Strict Aging Test Procedure

Before shipment, every display unit undergoes a rigorous aging test (burn‑in test) . During this process, the screen operates continuously under full‑load conditions for an extended period, simulating real‑world usage scenarios. This critical step ensures long‑term stability, identifies any potential component issues early, and guarantees that your display delivers reliable, flicker‑free performance from day one.

Pre‑Shipment Precision Calibration

Prior to packaging, our experienced engineers perform a comprehensive pre‑shipment calibration on each cabinet. Using advanced optical instruments, we fine‑tune brightness, color uniformity, and grayscale accuracy pixel by pixel. This meticulous process ensures that every unit achieves optimal visual consistency, so your screen arrives ready to deliver stunning, perfectly matched imagery – right out of the box.

Your Assurance of Quality

With our aging and calibration protocols, you can be confident that your display will perform flawlessly upon installation, providing the exceptional visual experience you expect.

FAQ: What are the differences between COB, GOB and SMD LED modules?

Comparison Table

AspectSMD (Surface‑Mounted Device)GOB (Glue‑on‑Board)COB (Chip‑on‑Board)
Technology PrincipleIndividual LED chips are soldered onto the PCB surface via SMT process.Based on SMD, a transparent protective adhesive layer is vacuum‑molded over the PCB and LED chips.LED chips are directly bonded (die‑attached) onto the PCB substrate and encapsulated as a whole, eliminating the individual package step.
Light Source TypePoint light sourcePoint light source (optimized by the protective layer)Surface light source
Pixel DensityLow to medium; difficult to achieve below P1.0Limited by SMD structure; hard to realize ultra‑fine pitchExtremely high; supports pixel pitches below P0.5
Protection PerformanceWeak; exposed chips are vulnerable to moisture and physical impactStrong – provides waterproof, dustproof, anti‑static, anti‑collision and other “ten‑fold” protective featuresStrongest – integrated encapsulation offers excellent resistance to impact, moisture, dust and static electricity
Display QualityVisible pixel grain at close viewing distances; physical gaps between chipsGood uniformity; 160° wide viewing angle; effectively reduces moiré patternsBest – seamless splicing, fine image without graininess, near‑180° viewing angle, precise color rendition
Heat DissipationAverageRelatively poor (the adhesive layer may hinder heat dissipation)Excellent – chips directly contact the PCB, low thermal resistance and fast heat conduction
MaintenanceEasy – individual LEDs can be replaced on‑siteModerately easy – protective layer reduces damage rate; field repair possibleDifficult – a faulty module usually requires full replacement; high repair cost
CostLow (mature technology)Medium (between SMD and COB)High (complex process and high equipment investment)
Typical ApplicationsOutdoor advertising, stage backdrops, stadiums, and other medium‑to‑large pitch scenariosPublic transport, education, retail, and other environments requiring enhanced protectionHigh‑end conference rooms, command & control centers, home theaters, showrooms – any ultra‑fine‑pitch, premium setting

Summary: Which one should you choose?

If you need...Recommended
Ultimate image quality + ultra‑fine pitch, and budget is not a primary concernCOB
High protection with a good balance of performance and costGOB
Cost‑effectiveness, larger pitch, and easy on‑site maintenanceSMD

Buy Micro Type COB LED Display Flip Chip Common Cathode Ultra Fine Display at wholesale prices
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