Amphenol HM2P09PD5110N9LF

Product Overview

Millipacs is a 2mm modular, Board-to-Board Interconnection system in Hard Metric (HM) configuration. It offers versatility through cost-effectiveness, user flexibility, and a broad range of availability. This system adheres to popular equipment practice standards, ensuring compatibility with all HM connectors and accessories. The 2mm pitch provides adequate spacing for PCB trace routing, optimizing board layers and reducing real estate compared to 2.54mm pitch systems. It is modular and scalable, available in standard lengths without loss of position. With three levels of mating contact lengths and different terminal lengths, Millipacs is suitable for various applications, including those with different PCB thicknesses, rear plug-up, and hot-swapping scenarios. Multipurpose center, coding, and guiding features facilitate easy and error-free mating. The system offers SI performance up to 3Gb/s with suitable pinning assignments and allows for customized loading through hybrid connectors integrating signal, power, and coaxial contacts, enabling versatile circuit designs. The two outer rows offer optional shielding. Millipacs conforms to IEC 917, IEC 61076-4-101, and Telcordia GR-1217-CORE standards, making it suitable for chassis-based packaging in communications, data, medical, industrial, and instrumentation segments. Optional hybrid modules are also available.

Product Attributes

Brand: Millipacs
System Type: 2mm modular, Board-to-Board Interconnection system
Configuration: Hard Metric (HM)
Standards Conformance: IEC 917, IEC 61076-4-101, Telcordia GR-1217-CORE, DIN 43356, IEEE 1301
Certifications: UL and CSA recognized
Insulator Material: Thermoplastic UL94 V-0 (standard press-fit), High temperature polymer (Pin-in-Paste terminations)
Contact Material: Copper Alloy
Contact Plating Material: Gold / Palladium Nickel (mating area), Tin over Nickel (press-fit/pinin-paste terminal area)
Packaging: Tray packaging (standard versions), Tape and Reel packaging (Pin-in-Paste versions)
Performance Levels: 3 (50 mating cycles), 2 (250 mating cycles), 1 (500 mating cycles)

Technical Specifications

Specification/Model	Details
Pitch	2mm
Hard Metric Standard	IEC 917, IEC 61076-4-101
SI Performance	Up to 3Gb/s
Operating Current	1.5A at 20C; 1.0A at 70C
Test Voltage	750Vrms
Contact Resistance	20m max.
Insulation Resistance	10⁴M min.
Mating Force	0.75N max. per contact pair
Withdrawal Force	0.15N min. per contact pair
Hertz Stress	200Kpsi min.
Misalignment (Longitudinal)	2.0mm
Misalignment (Transversal)	2.5mm
Operating Temperature Range	-55C to +125C
Vertical Header - HM2P07P	22 column, 50mm + MPC + location peg, 110 positions, Press-fit
Vertical Header - HM2P29P	22 column, 50mm + MPC + Guide pin option + location peg, 110 positions, Press-fit
Vertical Header - HM2P27P	12 column, 30mm + MPC + location peg, 60 positions, Press-fit
Vertical Header - HM2P40P	22 column, 50mm + MPC, 110 positions, Press-fit
Vertical Header - HM2P08P	25 column, 50mm, 125 positions, Press-fit
Vertical Header - HM2P70P	22 column, 44mm, 110 positions, Press-fit
Vertical Header - HM2P71P	19 column, 38mm, 95 positions, Press-fit
Vertical Header - HM2P78P	8 column, 16mm, 40 positions, Press-fit
Vertical Header - HM2P65P	25 column, 44mm + polarization on housing walls, 110 positions, Press-fit
Vertical Header - HM2P66P	22 column, 44mm + polarization on housing walls, 110 positions, Press-fit
Vertical Header - HM2P67P	19 column, 38mm + polarization on housing walls, 95 positions, Press-fit
Vertical Header - HM2P09P	11 column, 25mm + end polarization + location peg, 55 positions, Press-fit
Vertical Header - HM2P80P	11 column, 25mm + reversed + end polarization + location peg, 55 positions, Press-fit
Vertical Header - HM2A30P	50mm, 6 power/coax + MPC, 6 positions, Spl. Press-fit
Vertical Header - HM2P11P	50mm, 55 signal + 3 power/coax + MPC, 3 + 55 positions, Spl. Press-fit
Vertical Header - HM2A32P	25 mm, 3 power/coax + end polarization, 3 positions, Spl. Press-fit
Vertical Header - HM2P87P	22 column, 50mm + MPC + guide pin option + location peg, 176 positions, Press-fit
Vertical Header - HM2P95P	25 column, 50mm + polarization on walls, 200 positions, Press-fit
Vertical Header - HM2P88P	25 column, 50mm, 200 positions, Press-fit
Vertical Header - HM2P89P	11 column, 25mm + end polarization + location peg, 88 positions, Press-fit
Vertical Header - HM2P40S	22 column, 50 mm + MPC, 110 positions, Pin-in-Paste
Vertical Header - HM2P09S	11 column, 25mm + end polarization + location peg, 55 positions, Pin-in-Paste
Vertical Header - HM2P11S	50 mm, 55 signal + 3 power/coax + MPC, 3 + 55 positions, Pin-in-Paste
Target Markets/Applications	IP, Internet backbone, LAN/WAN interfaces, Core Switches, Routers, Hubs, Base Stations, Transmission Access Systems, Servers, Storage Units, Energy Management Systems, Data Acquisition systems, Control Systems, Railway Traffic Management, Renewable Energy, Avionics, Digital Image Processing, Video Surveillance, Sonar Systems, MRI Scanners, Diagnostic Equipment

Amphenol HM2P09PD5110N9LF

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Shenzhen ECER Network Technology Co., Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

Categories	Backplane Connector
Brand Name:	HM2P09PD5110N9LF
Packaging Details:	-
Delivery Time:	8周
Stock:	288000
Model Number:	HM2P09PD5110N9LF
MOQ:	576
Description:	Hard Metric, Standard RoHS