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HRS DF50-30DP-1V(52)

Categories Rectangular Connectors
Description: Connector Header 1mm Pitch 1A Surface Mount,Vertical -35℃~+85℃
Operating Temperature: -35℃~+85℃
Brand Name: DF50-30DP-1V(52)
Contact Material: Brass
Delivery Time: 1工作日
Model Number: DF50-30DP-1V(52)
Flame Retardant Rating: UL94V-0
MOQ: 1
Number of Rows: 2
Voltage Rating (Max): 100V
Stock: 5117
Packaging Details: SMD,P=1mm
Pitch: 1mm
Mounting Type: Surface Mount,Vertical
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HRS DF50-30DP-1V(52)

DF50 Series 1mm Pitch, Board to Cable Lock Connector

The DF50 Series is a 1mm pitch connector designed for board-to-cable connections, featuring a lock mechanism for secure mating. This series offers reliable electrical performance and is suitable for various electronic applications.

Brand

HIROSE

Product Name

DF50 Series

Pitch

1mm

Type

Board to Cable Lock Connector

Product Specifications

ItemSpecificationsConditions
Insulation resistanceNo less than 500MMeasured at DC 100V
Withstand voltageNo flashover or breakdownAC 300V is applied for one minute
Contact resistanceNo more than 30mMeasured at 1mA and no higher than 20mV
Vibration ResistanceNo electric outage of 1s or greater10 cycles in each of three directions at frequency 10-55 Hz, half amplitude 0.75 mm
Shock ResistanceNo electric outage of 1s or greaterAccelerated velocity: 490m/s for 11ms, half-sine in 3 directions, 3 times for each direction
Moisture-resistanceContact resistance: no more than 50m; Insulation resistance: no less than 100MTemperature: 402C; humidity: 90 to 95%, left as it is for 96 hours
Temperature cyclesContact resistance: no more than 50m; Insulation resistance: no less than 500M(-55C for 30 minutes 5 to 35C for 2 to 3 minutes 85C for 30 minutes 5 to 35C for 2 to 3 minutes) in 5 cycles
Push-pull durabilityContact resistance: no more than 50m30 times of push-pull operation
Solder Heat ResistanceNo dissolution of the resin part which will influence the performance.Reflow: according to the Recommended Temperature Profile. Hand soldering: temperature of soldering iron at 350C for 3 to 4 seconds

Materials

Product PartMaterialsColor / TreatmentUL Regulation
InsulatorLCPBlackUL94V-0
Header ContactBrassGold plating-
Metal fitting (on the board side)Brass (Note 1)Tin Plating-
Locking metal fittings (DF50)Stainless steel--
Crimp socket InsulatorPBTBlack (DF50A)
White (DF50S)
UL94V-0
Crimp contactPhosphorous BronzeGold plating-

Product Number Structure

ComponentExampleDescription
ConnectorDF50 - % DP - 1 V@Series Name: DF50 (Double-row pin header), DF50S (Double-row crimp socket), DF50A (Single-row)
@Wire connection method/Geometry of terminal: V: SMT Straight Type, H: SMT Right Angle Type
@Number of contacts: 20, 30, 40, 50 (Double-row); 2 to 16 (Single-row)
@Connector type: DP: Double-row pin header, DS: Double-row socket, P: Single-row pin header, S: Single-row socket
@Specifications: 51: SMT Embossed packaging, 52: SMT Embossed packaging (with cap, DF50)
@Contact Pitch: 1mm
Crimp contact% DF50 - 2830 SCF A@Applicable wire size: 2830: AWG28, 30; 3032: AWG30, 32 (Under development)
@Method type/Packaging type: SCF: Socket contact reel
@Plating specifications: A: Gold plating

Precautions

  • Recommended Temperature Profile (Compatible with lead-free soldering): Peak temperature: max 250C for no more than 10 seconds. Heating unit: 220C for no more than 60 seconds. Preheating unit: 150 to 180C for 90 to 120 seconds. Number of times: no more than 2 times. Measurement is conducted at the contact lead part.
  • Recommended hand soldering conditions: Temperature of soldering iron: 35010C, soldering time: 3 to 4 seconds.
  • Recommended screen thickness and aperture ratio: Thickness: 0.1mm, aperture ratio: 100%.
  • Warpage of the Board: A maximum of 0.02mm at the center of connector, as measured from either end of the connector.
  • Cleaning Conditions: IPA cleaning is allowed. Cleaning is not recommended because cleaning may change the push/pull feeling etc. Please contact us when you use other cleaning agents.
  • General Precautions: Do not insert crimp contact at a slanted angle. Refrain from pushing/pulling operation when the PCB is not mounted. Refrain from pushing/pulling operation with wires in your hand. Do not apply flux which will cause flux oozing on connector during hand soldering. Molded color may have slight differences between production lots, but this does not affect performance.
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