| Sign In | Join Free | My infospaceinc.com |
|
| Sign In | Join Free | My infospaceinc.com |
|
| Categories | Memory Connectors |
|---|---|
| Description: | Push-Push 1.8mm MicroSD Card SMD PC Card Sockets RoHS |
| Card Type: | MicroSD Card |
| MOQ: | 1000 |
| Packaging Details: | SMD |
| Height Above Board: | 1.8mm |
| Model Number: | TFW13-N1S1-2000-A |
| Card Connection Mode: | Push-Push |
| Delivery Time: | 3-5工作日 |
| Brand Name: | TFW13-N1S1-2000-A |
| Stock: | 100000 |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH., which is designed and manufactured by Company. This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH. connector products designed and manufactured by our company.
TFW13-N1S1-2000-A
T-Flash type CONN.
A/0
1 / 8
The harmful material can follow the requirement of RoHS.
Products required tray or carrier tape should meet the proper specification per purchase order. Connector container and the packaging specification is shown in customer drawing. The product uses tape packaging, specific specifications are shown in the customer drawing.
Manufacturers name, industry recognized logo, or customer approved marks.
Any vehicle can be adopted for the transportation, but moisture-proof and no mechanical damage.
Temperature: -25~+85, Relative humidity: 80%, Not to storage in corrosive environments. A re-qualification test shall be conducted immediately while the storage duration exceed 6 months.
| Item | Requirements | Test Methods |
|---|---|---|
| Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact resistance (Low Level) | 80 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). |
| Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max.. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing | Mate and unmate connector for 5000 cycles. |
|
