TE Connectivity 214548-E

Categories	Power Connectors
Number of Pins:	5P
Description:	5 Position Board to Board Connector Surface Mount,P=2mm Gold
Operating Temperature:	-55℃~+125℃
Number of Rows:	1
Current Rating:	18A
Packaging Details:	SMD,P=2mm
Mounting Type:	Surface Mount,Vertical
Brand Name:	214548-E
Stock:	30000
Delivery Time:	25-42 weeks
MOQ:	300
Contact Plating:	Gold
Pitch:	2mm
Model Number:	214548-E

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Shenzhen ECER Network Technology Co., Ltd.

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Product Details
Company Profile

TE Connectivity 214548-E

Product Overview

This product is a female connector designed for Surface Mount Device (SMD) applications, specifically featuring a power management capability. It is packaged in tape-on-reel format for automated assembly, with each unit containing 300 pieces. The connector boasts gold-plated contact areas for reliable performance and tin-plated terminal areas with specified plating thickness.

Product Attributes

Brand: ERNI
Packaging: Tape on Reel
Packaging Unit: 300 pcs

Technical Specifications

Specification	Value
Performance Level	1
Contact Area Plating	Gold plating
Terminal Area Plating	Tin plating 4-6m
Coplanarity of Termination Area	≤ 0.1mm
Reel Off Direction	100 330 32.5
Hood Dimension	11.55 x 6.5 mm
Drill Tool Diameter	8 ±0.03 mm
PCB Layout Proposal Drill Diameter	1.5 ±0.03 mm
PCB Layout Proposal Hole Diameter	0.7 ±0.03 mm
PCB Layout Proposal Hole Spacing	0.65 mm
PCB Layout Proposal Pad Width	0.8 mm
PCB Layout Proposal Pad Length	0.8 mm
PCB Layout Proposal Pad to Pad Spacing	3 mm
PCB Layout Proposal Pad to Pad Spacing (alternate)	2.6 mm
PCB Layout Proposal Pad to Pad Spacing (alternate)	9 mm
PCB Layout Proposal Pad to Pad Spacing (alternate)	0.85 mm
PCB Layout Proposal Pad to Pad Spacing (alternate)	3 x 3 = 11
PCB Layout Proposal Pad to Pad Spacing (alternate)	2
PCB Layout Proposal Pad to Pad Spacing (alternate)	0.85
PCB Layout Proposal Pad to Pad Spacing (alternate)	4 x 2 = 0.9
PCB Layout Proposal Pad to Pad Spacing (alternate)	0.75
PCB Layout Proposal Pad to Pad Spacing (alternate)	4.45
PCB Layout Proposal Pad to Pad Spacing (alternate)	7.75
PCB Layout Proposal Pad to Pad Spacing (alternate)	5.5
PCB Layout Proposal Pad to Pad Spacing (alternate)	0.75
PCB Layout Proposal Pad to Pad Spacing (alternate)	4.15
PCB Layout Proposal Pad to Pad Spacing (alternate)	0.8
PCB Layout Proposal Pad to Pad Spacing (alternate)	4 x 2 = 3.85
PCB Layout Proposal Pad to Pad Spacing (alternate)	8
PCB Layout Proposal Pad to Pad Spacing (alternate)	11.55
PCB Layout Proposal Pad to Pad Spacing (alternate)	a1
PCB Layout Proposal Pad to Pad Spacing (alternate)	16
PCB Layout Proposal Pad to Pad Spacing (alternate)	32
PCB Layout Proposal Pad to Pad Spacing (alternate)	a5

TE Connectivity 214548-E

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