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Amphenol HM2P95PD8110N9LF

Categories Backplane Connector
Brand Name: Amphenol
MOQ: 50
Stock: 15000
Description: Hard Metric, Standard RoHS
Packaging Details: -
Model Number: HM2P95PD8110N9LF
Delivery Time: 12-15 weeks
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Amphenol HM2P95PD8110N9LF

Product Overview

The MILLIPACS 2mm HARD METRIC SERIES offers a modular, board-to-board and cable-to-board interconnection system in a Hard Metric (HM) configuration, designed in accordance with IEC 917, IEC 61076-4-101, and Telcordia GR-1217-CORE standards. This popular backplane connector system is recognized for its cost-effectiveness, user flexibility, standardization, and broad availability. The MILLIPACS series is extensively utilized in chassis-based packaging for communications, data, medical, and industrial & instrumentation segments. Vertical header connectors are available in standard signal modules of 5 and 8 rows, supporting up to 125 signal contacts (5-row) or 200 signal contacts (8-row) per 50mm length. Hybrid modules are also offered, incorporating signal pins, power, and coax contacts. These vertical headers mate with right-angle receptacles, vertical receptacles, and cable connectors via shrouds. Key benefits include adequate spacing for PCB trace routing, modularity scalable by 25mm to 50mm, and multiple mating contact lengths. The system supports SI performance up to 10Gbps, enabling a cost-effective transition to higher speeds while retaining existing backplane architecture. Hybrid connectors allow for versatile circuit designs.

Product Attributes

  • Brand: MILLIPACS
  • Configuration: 2mm Hard Metric (HM)
  • Standards Compliance: IEC 917, IEC 61076-4-101, Telcordia GR-1217-CORE, DIN 43356, IEEE 1301
  • Insulator Material: Thermoplastic UL94V0 (standard press-fit), High-Temperature polymer (Pin-in-paste terminations)
  • Contact Material: Copper Alloy
  • Contact Plating: Gold / Palladium nickel (mating area), Tin over Nickel (press-fit/pinin-paste terminal area)
  • Approvals: UL and CSA recognized
  • Packaging: Tray Packaging (standard versions), Tape and reel packaging (Pin-in-paste versions)

Technical Specifications

Header SeriesTypeMax. No. of Signal PinsMounting StyleFeaturesPart Number
HM2P07P5110Press-fit22 column, 50mm + MPC+ location peg
HM2P29P5110Press-fit22 column, 50mm +MPC + Guide pin option + location peg
HM2P27P560Press-fit12 column, 30mm + MPC + location peg
HM2P40P5110Press-fit22 column, 50mm + MPC
HM2P08P5125Press-fit25 column, 50mm
HM2P70P5110Press-fit22 column, 44mmB22
HM2P71P595Press-fit19 column, 38mmB19
HM2P65P5125Press-fit25 column, 50mm + polarization on housing wallsAB
HM2P66P5110Press-fit22 column, 44mm + polarization on housing wallsAB22
HM2P67P595Press-fit19 column, 38mm + polarization on housing wallsAB19
HM2P09P555Press-fit11 column, 25mm + end polarization + location pegC
HM2P80P555Press-fit11 column, 25mm + reversed + end polarization + location pegCR
HM2A30P56Spl. Press-fit50mm, 6 power/coax + MPCL
HM2P11P555Spl. + 55 Press-fit50mm, 55 signal + 3 power/coax + MPCM
HM2A32P53Spl. Press-fit25 mm, 3 power/coax + end polarizationN
HM2P87P8176Press-fit22 column, 50mm + MPC + guide pin option + location pegD
HM2P95P8200Press-fit25 column, 50mm + polarization on wallsDE
HM2P88P8200Press-fit25 column, 50mmE
HM2P89P888Press-fit11 column, 25mm + end polarization + location pegF
HM2P40S5110Pin-in-paste22 column, 50 mm + MPCA
HM2P09S555Pin-in-paste11 column, 25mm + end polarization + location pegC
HM2P11S555Spl. + 55 Pin-in-paste50 mm, 55 signal + 3 power/coax + MPCM
Electrical Performances
Operating Current1.5 A at 20C; 1.0 A at 70C
Test Voltage750 Vrms
Contact Resistance20 m max
Insulation Resistance104 M min
Mechanical Performance
Mating Force0.75 N max per contact pair
Withdrawal Force0.15 N min per contact pair
Hertz Stress200 Kpsi min
Misalignment (Longitudinal)2.0mm
Misalignment (Transversal)2.5mm
Inclination2.0
Environmental
Operating Temperature-55C to +125C
Specifications
Product SpecificationGS-12-203
Application SpecificationGS-20-034

Target Markets/Applications: Communications (IP, LAN/WAN, Core Switches, Routers, Hubs, Base Stations, Transmission Access Systems), Data (Servers, Storage Units), Industrial & Instrumentation (Data Acquisition, Railway Traffic Management, Control Systems, Energy & Power, Avionics, Digital Image Processing, Multimedia, Signage, Video Surveillance, Radar, Sonar, UAV), Medical (MRI Scanners, Diagnostic Equipment).

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