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| Categories | Memory Connectors |
|---|---|
| Model Number: | SMN-302-ACP7 |
| Operating Temperature: | -40℃~+85℃ |
| Brand Name: | SMN-302-ACP7 |
| MOQ: | 1600 |
| Description: | Card Connector NANO SIM Push-Push Surface Mount |
| Height Above Board: | 1.24mm |
| Packaging Details: | SMD |
| Card Type: | Nano-SIM Card |
| Connector Type: | Connector and Ejector |
| Stock: | 5000 |
| Card Connection Mode: | Push-Push |
| Delivery Time: | 12-17工作日 |
| Card Detection: | With Card Detect |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This product is a 1.24 NANO SIM PUSH connector designed for various electronic applications. It features a durable construction with specific plating requirements for reliable connectivity. The connector is suitable for applications requiring a high number of cycles and operates within a defined temperature range.
XunPu Electronics
DongGuan
ROHS Compliant
LCP UL94V-0
Copper Alloy
Stainless Steel
Stainless Steel
Thermoplastic
Copper Alloy
| No. | Description | QTY | Material | Remarks |
|---|---|---|---|---|
| 1 | HOUSING | 1 | LCP UL94V-0 | |
| 2 | SHELL | 1 | STAINLESS STEEL | 30u"MIN GOLD PLATING ON SOLDERING AREA. |
| 3 | CONTACT | 1 | COPPER ALLOY | 8 |
| 4 | DETECT PIN | 1 | COPPER ALLOY | |
| 5 | SLIDE | 1 | STAINLESS STEEL | |
| 6 | SPRING | 1 | STAINLESS STEEL | |
| 7 | LINK | 1 | STAINLESS STEEL |
| Item | Specification | Requirement |
|---|---|---|
| FINISH | CONTACT: 8 "MIN NICKEL UNDER PLATED, 1u"MIN GOLD PLATING ON CONTACT AREA, GOLD FLASH PLATING ON SOLDERING AREA | |
| SHELL | 30u"NICKEL UNDER PLATED; 1u"MIN GOLD PLATING ON SOLDERING AREA. | |
| RATED CURRENT | 0.5A | |
| CONTACT RESISTANCE | 50m MAX | |
| INSULATION RESISTANCE | 1000M MIN 200V DC FOR 1 MINUTE | |
| DIELECTRIC WITHSTANDING VOLTAGE | 500V AC FOR 1 MINUTE. | |
| DURABILITY | 3000 CYCLES MIN | |
| OPERATING TEMP | -30C~+85C | |
| STORAGE TEMP | -40C~+85C | |
| RECOMMENDED PROCESS CONDITION | IRREFLOW PEAK TEMPERATURE AND TIME: 250C, 5-10S | |
| METALMASK THICKNESS | 0.10MM MIN |
| Nave | Description | QTY |
|---|---|---|
| c1 | RST OF SIM | 1 |
| c2 | CLK OF SIM | 1 |
| c3 | GND OF SIM | 1 |
| c4 | VPP OF SIM | 1 |
| c5 | I/O OF SIM | 1 |
| c6 | SW | 1 |
| c7 | PAD AREA | 1 |
| Pin Assignment | Description | QTY |
|---|---|---|
| 1 | VCC OF SIM | 1 |
| 2 | RST OF SIM | 1 |
| 3 | CLK OF SIM | 1 |
| 4 | GND OF SIM | 1 |
| 5 | VPP OF SIM | 1 |
| 6 | I/O OF SIM | 1 |
| 7 | SW | 1 |
|
